| 23/Mar/2020 | 38249999 | Additive in the process of plating circuit XP 263TMR-S1 (Sodium chloride 2 ~ 6%, Ethylenediaminetetraacetic acid disodium 11 ~ 16%, Butyl alcohol 3 ~ 8%, Water (Balance)), packed in 1 carton, 200kgs / carton 100% new | Korea (Republic) | kg | 200.00 | 7,156.00 | 35.78 | View Importer | View Supplier |
| 15/Jan/2019 | 38249999 | Chemical XP 240A-R0 (containing Sodium Carbonate 0.01-0.05% , Water) , used as an additive in plate plating process. New 100% | Korea (Republic) | Kg | 20.00 | 39.20 | 1.96 | View Importer | View Supplier |
| 15/Jan/2019 | 38249999 | Chemical XP 360SP-R1 (contains Acetone 1-10% , 1-hydroxyethylidene-1 , 1-diphosphonic acid 1-10% , water balance) , used as an additive in plate plating. New 100% | Korea (Republic) | Kg | 100.00 | 819.00 | 8.19 | View Importer | View Supplier |
| 15/Jan/2019 | 38249999 | Chemical XP 124SL-R10 (contains Amido sulfuric acid 1.0 ~ 10.0% , Water (balance) used as additives in the plating process (Not KBHC , TC). 100% new goods | Korea (Republic) | Kg | 80.00 | 195.20 | 2.44 | View Importer | View Supplier |
