31/Mar/2020 | 38249999 | Enthobrite NCZ Dimension A + - is a preparation used to level the zinc coating used in plating industry with Polyquaternium-2 -CAS component: 68555-36-2; Water -CAS: 7732-18-5, 100% new. | Singapore | liter | 800.00 | 2,992.00 | 3.74 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 07020123 # & Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1%, Sulfuric Acid 1-5%, Copper Sulfate <1% used in electroplating technology | Taiwan | liter | 300.00 | 5,646.00 | 18.82 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 07020131 # & MICROFILL THF LEVELER SOLUTION (TM) containing 90-99% Water, Sulfuric Acid <1.0%, Copper sulfate <1.0%, Imidazole polymer <1.0% used in electroplating technology | Taiwan | liter | 100.00 | 7,319.00 | 73.19 | View Importer | View Supplier |
26/Mar/2020 | 38249999 | 07020123 # & Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1%, Sulfuric Acid 1-5%, Copper Sulfate <1% used in electroplating technology | Taiwan | liter | 1,000.00 | 18,820.00 | 18.82 | View Importer | View Supplier |
26/Mar/2020 | 38249999 | 07020123 # & Microfill EVF Leveler Solution contains 90-99% water, Oxyalkylene Polymer <1%, Sulfuric Acid 1-5%, Copper Sulfate <1% used in electroplating technology | Taiwan | liter | 80.00 | 1,505.60 | 18.82 | View Importer | View Supplier |
25/Mar/2020 | 38249999 | 07020123 # & Microfill EVF Leveler Solution contains 90-99% water, Oxyalkylene Polymer <1%, Sulfuric Acid 1-5%, Copper Sulfate <1% used in electroplating technology | Taiwan | liter | 300.00 | 5,646.00 | 18.82 | View Importer | View Supplier |
23/Mar/2020 | 38249999 | 07020123 # & Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1%, Sulfuric Acid 1-5%, Copper Sulfate <1% used in electroplating technology | Taiwan | liter | 300.00 | 5,646.00 | 18.82 | View Importer | View Supplier |
23/Mar/2020 | 38249999 | 07020131 # & MICROFILL THF LEVELER SOLUTION (TM) containing 90-99% Water, Sulfuric Acid <1.0%, Copper sulfate <1.0%, Imidazole polymer <1.0% used in electroplating technology | Taiwan | liter | 100.00 | 7,319.00 | 73.19 | View Importer | View Supplier |
11/Mar/2020 | 38249999 | 07020123 # & Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1%, Sulfuric Acid 1-5%, Copper Sulfate <1% used in electroplating technology | Taiwan | liter | 600.00 | 11,292.00 | 18.82 | View Importer | View Supplier |
10/Mar/2020 | 38249999 | Atnic MTL L - hh chemicals Organic diol-CAS number: 110-63-4; Glycol - CAS number: 107-21-1; Aromatic carboxylic acid - CAS number: 50-21-5 and water used for leveling in matte nickel plating in plating industry, 100% new | China | liter | 200.00 | 1,800.00 | 9.00 | View Importer | View Supplier |
05/Mar/2020 | 38249999 | 07020123 # & Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1%, Sulfuric Acid 1-5%, Copper Sulfate <1% used in electroplating technology | Taiwan | liter | 500.00 | 9,410.00 | 18.82 | View Importer | View Supplier |
03/Mar/2020 | 38249999 | 07020123 # & Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1%, Sulfuric Acid 1-5%, Copper Sulfate <1% used in electroplating technology | Taiwan | liter | 600.00 | 11,292.00 | 18.82 | View Importer | View Supplier |
02/Mar/2020 | 38249999 | Microfill EVF Leveler Solution contains 90-99% water, Oxyalkylene Polymer <1%, Sulfuric Acid 1-5%, Copper Sulfate <1% used in electroplating technology. | Taiwan | liter | 4,480.00 | 46,472.99 | 10.37 | View Importer | View Supplier |