| 31/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-505kg) | Taiwan | Lit | 500.00 | 9,410.00 | 18.82 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | Enthobrite NCZ Dimension A + - is a product used to level the zinc coating used in plating industry with Polyquaternium-2-CAS: 68555-36-2; Water-CAS: 7732-18-5. New 100% | Singapore | Lit | 1,600.00 | 5,984.00 | 3.74 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-303kg) | Taiwan | Lit | 300.00 | 5,646.00 | 18.82 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-606kg) | Taiwan | Lit | 600.00 | 11,292.00 | 18.82 | View Importer | View Supplier |
| 09/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-505kg) | Taiwan | Lit | 500.00 | 9,410.00 | 18.82 | View Importer | View Supplier |
| 03/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-606kg) | Taiwan | Lit | 600.00 | 11,292.00 | 18.82 | View Importer | View Supplier |
| 03/Jan/2019 | 38249999 | Atnic MTL L - a mixture of chemicals Organic diol-CAS number: 110-63-4; Glycol-CAS number: 107-21-1; Aromatic carboxylic acid-CAS number: 50-21-5 and water used for leveling in matt nickel plating in plating industry , h | China | Lit | 100.00 | 900.00 | 9.00 | View Importer | View Supplier |
| 03/Jan/2019 | 38249999 | Atcop Cu 88 Make up - a mixture of chemicals SULFURIC ACID-CAS number: 7664-93-9 and water is a leveling agent in copper plating used in plating industry , 100% new | China | Lit | 100.00 | 600.00 | 6.00 | View Importer | View Supplier |
| 03/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-505kg) | Taiwan | Lit | 500.00 | 9,410.00 | 18.82 | View Importer | View Supplier |
