| 31/Jan/2019 | 38249999 | Cuposit (TM) 253S Electroless Copper - water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry (20L / carton) | Japan | Lit | 60.00 | 754.20 | 12.57 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Moisturizing solution used in offset printing MAGIC PIX SF FOUN-AF (ingredient: ethylene glycol monobutyl ether , glycerol , ethylene glycol , citric acid , monohydrate , isothiazolinones) liquid (25L / carton) , new 100% | Malaysia | Lit | 4,000.00 | 11,920.00 | 2.98 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | Chemical used in electroplating ZN 686A: Mixture of sodium benzoate and additives , liquid , packed in 200 liters / carton , 100% new | Singapore | Lit | 4,800.00 | 8,160.00 | 1.70 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | COLZINC ACF-II 4X: Polyamine solution and inorganic salt mixture used in electroplating , liquid , type 208 liters / carton , 100% new | United States of America | Lit | 208.00 | 2,392.00 | 11.50 | View Importer | View Supplier |
| 22/Jan/2019 | 38249999 | DUCTOLITE MAINTENANCE. Chemical products used in the plating industry , whose main components are sulphate salt, chloride and additives. 30lit / carton. Cas code 2495-39-8 , 7732-18-5 , brand new 100% | India | Lit | 240.00 | 624.00 | 2.60 | View Importer | View Supplier |
| 22/Jan/2019 | 38249999 | DUCTOLITE SPECIAL ADDITIVE.Chemical chemical used in plating industry , whose main components are sulphate salt, chloride and additives. 30lit / carton , cas code 50-00-0 , 7732-18-5 , brand new 100% | India | Lit | 360.00 | 792.00 | 2.20 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | Microfill (TM) EVF-C2 solution contains Sulfuric acid (H2SO4) 0 , 1-1% , Copper sulfate (CuSO4) 0 , 1-1% , Formaldehyde (CH2O) 0 , 1-1% , Polyalkyleneglycol used in plating industry 11095904 (20 liters / carton) (1,015 Kg) | Japan | Lit | 1,280.00 | 17,716.17 | 13.84 | View Importer | View Supplier |
| 16/Jan/2019 | 38249999 | Chemical product SOLDERON (TM) RD CONCENTRATE 5L PLASTIC DRUM , used for tinned copper wire. Package: 5 liters / carton. New 100% | China | Lit | 125.00 | 1,187.50 | 9.50 | View Importer | View Supplier |
| 16/Jan/2019 | 38249999 | Chemical product SOLDERON (TM) MHS-W ADDITIVE 20L PLASTIC DRUM , used for copper wire tin plating tank. Package: 20 liters / carton. New 100% | Japan | Lit | 360.00 | 7,920.00 | 22.00 | View Importer | View Supplier |
| 15/Jan/2019 | 38249999 | Cuposit (TM) 253S Electroless Copper - water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry (20L / carton) | Japan | Lit | 300.00 | 3,771.00 | 12.57 | View Importer | View Supplier |
| 04/Jan/2019 | 38249999 | Blackhole AF Conditioner solution containing Aminoethylethanolamine (C4H12N2O) 40-45% is a chemical used to treat electroplating before plating (20 liters / carton) | Taiwan | Lit | 100.00 | 2,786.60 | 27.87 | View Importer | View Supplier |
| 04/Jan/2019 | 38249999 | Blackhole Additive 483 solution containing Nitrogen-containing heterocyclic compound 70-80% is a chemical used to treat pre-plating conductivity (4 liters / carton) | Taiwan | Lit | 16.00 | 798.29 | 49.89 | View Importer | View Supplier |
| 04/Jan/2019 | 38249999 | Blackhole Cleaner solution containing Aminoethylethanolamine (C4H12N2O) 18-24% is a chemical used to conduct electricity treatment before plating (20 liters / carton) | Taiwan | Lit | 200.00 | 2,618.52 | 13.09 | View Importer | View Supplier |
| 03/Jan/2019 | 38249999 | Cuposit (TM) 253S Electroless Copper - water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry (20L / carton) | Japan | Lit | 60.00 | 754.20 | 12.57 | View Importer | View Supplier |
