| 30/Jan/2019 | 38249999 | Chemical KG-545Y contains Ethylene di-amine tetra-acetic acid (C10H16N2O8) 1% and Organic acid 50% are chemicals used in the plating industry of Nickel (20 Liters / Can) - 100% new goods | Japan | Lit | 80.00 | 840.16 | 10.50 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Chemical processing used in plating , main products: support of acetate salts , nickel sulphates , sodium , additives in TOP SEAL acid field H-298 , liquid 20Lit / Can , New 100% (cas6018-89-9 , 7732-18-5) , PTPL: 10023 / TB-TCHQ | Japan | Lit | 15,000.00 | 44,722.61 | 2.98 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Filler used in plating ASLES EP2-P , including polymeric acid , fumaric acid , surfactants , liquid , liquid , 20 liters / can , 100% new (CAS7732-18-5) (KQPTPL: 9242 / TB- GOP) | Japan | Lit | 1,000.00 | 7,387.02 | 7.39 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Chemical KG-545Y contains Ethylene di-amine tetra-acetic acid (C10H16N2O8) 1% and Organic acid 50% are chemicals used in the plating industry of Nickel (20 Liters / Can) - 100% new goods | Japan | Lit | 320.00 | 3,360.65 | 10.50 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 (TM) solution contains Water 90-99% , Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology ( 20L / T-404kg) | Japan | Lit | 400.00 | 14,864.00 | 37.16 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 (TM) solution contains Water 90-99% , Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology ( 20L / T-303kg) | Japan | Lit | 300.00 | 11,148.00 | 37.16 | View Importer | View Supplier |
| 16/Jan/2019 | 38249999 | Chemical product SOLDERON (TM) MHS-W ADDITIVE 20L PLASTIC DRUM , used for copper wire tin plating tank. Package: 20 liters / carton. New 100% | Japan | Lit | 360.00 | 7,920.00 | 22.00 | View Importer | View Supplier |
| 15/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 (TM) solution contains Water 90-99% , Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology ( 20L / T-303kg) | Japan | Lit | 300.00 | 11,148.00 | 37.16 | View Importer | View Supplier |
| 11/Jan/2019 | 38249999 | 3 # & Preparations used in plating , electroplating chemicals , other finishing agents , tp is a mixture of acetate salts , sulphates of Nikel , sodium , additives TOP SEAL H-298 (L ). Packing 20 LTR / UNL. New 100% | Japan | Lit | 960.00 | 4,368.00 | 4.55 | View Importer | View Supplier |
| 11/Jan/2019 | 38249999 | 3 # & Preparations used in plating , electroplating chemicals , other finishing agents , tp is a mixture of acetate salts , sulphates of Nikel , sodium , additives TOP SEAL H-298 (L ). Packing 20 LTR / UNL. New 100% | Japan | Lit | 1,560.00 | 7,098.00 | 4.55 | View Importer | View Supplier |
| 11/Jan/2019 | 38249999 | 3 # & Preparations used in plating , electroplating chemicals , other finishing agents , tp is a mixture of acetate salts , sulphates of Nikel , sodium , additives TOP SEAL H-298 (L ). Packing 20 LTR / UNL. New 100% | Japan | Lit | 1,560.00 | 7,098.00 | 4.55 | View Importer | View Supplier |
| 11/Jan/2019 | 38249999 | 3 # & Preparations used in plating , electroplating chemicals , other finishing agents , tp is a mixture of acetate salts , sulphates of Nikel , sodium , additives TOP SEAL H-298 (L ). Packing 20 LTR / UNL. New 100% | Japan | Lit | 2,000.00 | 9,100.00 | 4.55 | View Importer | View Supplier |
| 09/Jan/2019 | 38249999 | STY-104 # & Chemical products used in plating industry with the main ingredient is Alkyl Glycol Halogenated derivatives of Sulfate STY-104 , capacity of 20L / ctn , 100% new goods. | Japan | Lit | 20.00 | 119.17 | 5.96 | View Importer | View Supplier |
