31/Mar/2020 | 38101000 | Solder paste LFM-48W MR-NH (500G / PC), main ingredients: Sn 7440-31-5 (85.4%), Ag 7440-22-4 (2.66%), Cu 7440-50-8 (0.44 %), used for soldering electronic circuit boards, 100% new goods. | Japan | piece/pcs | 40.00 | 1,463.20 | 36.58 | View Importer | View Supplier |
31/Mar/2020 | 38101000 | TRI Chemical, cleaning metal surfaces, used in metal plating process. Chemical ingredients: sulfuric acid 29% -35%, Proprietary additive mixture max 5% and water. New 100% | Japan | liter | 8,000.00 | 86,720.00 | 10.84 | View Importer | View Supplier |
25/Mar/2020 | 38101000 | Chemical DP-333 CLEAN - Metal cleaning products used in plating, tp include: sulfuric acid (2.4%), surfactants, liquid, 15 liters / can, 100% new (cas7664-93-9 ; 7732-18-5) Business results: 0810 / TB-KĐ4 | Japan | liter | 405.00 | 1,924.79 | 4.75 | View Importer | View Supplier |
25/Mar/2020 | 38101000 | Preparations used to remove rust and dirt of metal surfaces based on sodium hydroxide SCUTT CLEAN, in powder form, 20kg / bag, new 100% (cas1310-73-2) (KPTPTPL: 3057 / HQBH-VN) | Japan | kg | 120.00 | 928.79 | 7.74 | View Importer | View Supplier |
25/Mar/2020 | 38101000 | Preparing to clean the metal surface used in plating, powder, 20kg / bag TOP RIP F-85, tp include organic compounds, inorganic salts, 100% new # & JP | Japan | kg | 60.00 | 676.22 | 11.27 | View Importer | View Supplier |
11/Mar/2020 | 38101000 | Solder paste LFM-48U TM-HP (ST) 120gram / pc (main ingredient: Sn 7440-31-5 (82.99%), Ag 7440-22-4 (2.58%), Cu 7440-50-8 ( 0.43%)), used for soldering electronic circuit boards, new goods 100% .. | Japan | piece/pcs | 20.00 | 693.27 | 34.66 | View Importer | View Supplier |
05/Mar/2020 | 38101000 | KX2299 # & Chemicals DP-333 CLEAN - Metal cleaning products used in plating, 100% new | Japan | liter | 600.00 | 3,600.00 | 6.00 | View Importer | View Supplier |
04/Mar/2020 | 38101000 | NL520 # & TOP TOP chemicals 320 (25KGS) - Preparations for cleaning metal surfaces used in plating with the main ingredient is a mixture of acid acetie, 100% new goods | Japan | kg | 50.00 | 470.00 | 9.40 | View Importer | View Supplier |
04/Mar/2020 | 38101000 | Solder additive, composed of a number of salts, potassium acids and water, used to increase adhesion during welding, type 1kg / pc. New 100% | Japan | piece/pcs | 3.00 | 110.62 | 36.87 | View Importer | View Supplier |
04/Mar/2020 | 38101000 | Solder additive, composed of boric acid, borax and water, used to increase solder adhesion, type 500g / pc. New 100% | Japan | piece/pcs | 5.00 | 105.35 | 21.07 | View Importer | View Supplier |
04/Mar/2020 | 38101000 | Soldering additives in powder form, composed of zinc salt, sodium, potassium, used to increase adhesion when welding, type 250g / pc. New 100% | Japan | piece/pcs | 5.00 | 184.37 | 36.87 | View Importer | View Supplier |
03/Mar/2020 | 38101000 | SOLDER CREAM 1 # & M705-SHF Soldering Cream (Tin (CAS: 7440-31-5), Silver (CAS: 7440-22-4), Copper (CAS: 7440-50-8), Rosin, Solvent) (0.5kg / vial) used to attach components to printed circuit boards. 100% new goods | Japan | bottle / jar / tube | 230.00 | 6,670.00 | 29.00 | View Importer | View Supplier |
29/Jan/2019 | 38101000 | Additive CLEANER 160 (Sodium Hydroxide NaOH , CAS code: 1310-73-2) , used in electroplating industry , 100% new | Japan | Kg | 100.00 | 847.00 | 8.47 | View Importer | View Supplier |
28/Jan/2019 | 38101000 | Purified metal cleaning products used in oxygen , liquid , 20 liters / canTOP RIP PF-1 , tp: compound of compound , sodium hydroxide , basic salt and organic chemicals , new 100% (107-15-3 , 102-71-6 , 1310-73 -2 , 141-43-5) KQPTPL9159 / TB-TCHQ | Japan | Lit | 260.00 | 2,013.18 | 7.74 | View Importer | View Supplier |
28/Jan/2019 | 38101000 | preparation for cleaning metal surfaces , used in cement , tp: nickel acetate , sodium acetate , compounding agent TOP SEAL DX-500 , powder type, 10kg / carton , new 100% (cas6018-89-9 , 127-09- 3) Business results: 972 / TB-TCHQ | Japan | Kg | 100.00 | 1,375.05 | 13.75 | View Importer | View Supplier |