27/Mar/2020 | 35069100 | RAA34549103 # & Adhesive from epoxy resin, used for manufacturing the circuit of mobile phones (Bisphenol F 75 - 85%, Amine Adduct 10 - 20%, Imidazole 1 - 5%, Pigment 0.1 - 1.0%, Secret 3 - 10%) ( RAA34549103). 100% new | Korea (Republic) | ml | 250.00 | 47.47 | 0.19 | View Importer | View Supplier |
21/Mar/2020 | 35069100 | CHEMICAL223 # & Binder made from Polymer BOND FB-500B inspection result No. 2516 / TB-PTPLHCM-14 October 17, 2014 1 PC / 333 MLT, used to fix 2 materials together, new product 100 % | Japan | ml | 19,980.00 | 490.80 | 0.02 | View Importer | View Supplier |
13/Mar/2020 | 35069100 | CHEMICAL223 # & Binder made from Polymer BOND FB-500B inspection result No. 2516 / TB-PTPLHCM-14 October 17, 2014 1 PC / 333 MLT, used to fix 2 materials together, new product 100 % | Japan | ml | 6,660.00 | 163.60 | 0.02 | View Importer | View Supplier |
12/Mar/2020 | 35069100 | RAA34549103 # & Adhesive from epoxy resin, used for manufacturing the circuit of mobile phones (Bisphenol F 75 - 85%, Amine Adduct 10 - 20%, Imidazole 1 - 5%, Pigment 0.1 - 1.0%, Secret 3 - 10%) ( RAA34549103). 100% new | Korea (Republic) | ml | 750.00 | 142.42 | 0.19 | View Importer | View Supplier |
04/Mar/2020 | 35069100 | RAA34620201 # & Adhesive from epoxy resin, used for manufacturing mobile phone circuits (RAA34620201), 100% new | Korea (Republic) | ml | 30.00 | 36.41 | 1.21 | View Importer | View Supplier |
04/Mar/2020 | 35069100 | RAA34620201 # & Adhesive from epoxy resin, used for manufacturing blisters of mobile phones (RAA34620201). 100% new | Korea (Republic) | ml | 1,560.00 | 1,893.20 | 1.21 | View Importer | View Supplier |
04/Mar/2020 | 35069100 | RAA34620201 # & Adhesive from epoxy resin, used for manufacturing blisters of mobile phones (RAA34620201). 100% new | Korea (Republic) | ml | 3,030.00 | 3,677.18 | 1.21 | View Importer | View Supplier |
09/Jan/2019 | 35069100 | Matty used to pair BOND FB-500B (333ML / 1PC) - 100% new | Japan | Ml | 26,640.00 | 617.47 | 0.02 | View Importer | View Supplier |