| 31/Jan/2019 | 38249999 | Water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry - cuposit TM 253A-2 electroless copper (20L / T) | Taiwan | Lit | 760.00 | 2,584.00 | 3.40 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Cuposit (TM) 253S Electroless Copper - water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry (20L / carton) | Japan | Lit | 60.00 | 754.20 | 12.57 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry - cuposit TM 253A-2 electroless copper (20L / T) | Taiwan | Lit | 600.00 | 2,040.00 | 3.40 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | Water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry - cuposit TM 253A-2 electroless copper (20L / T) | Taiwan | Lit | 4,000.00 | 13,600.00 | 3.40 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | Water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry - cuposit TM 253A-2 electroless copper (20L / T) | Taiwan | Lit | 4,000.00 | 13,600.00 | 3.40 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution works to improve adhesion and surface quality, used in motherboard manufacturing technology (CuSO4: 10-20% , Sulfuric acid <1 % , Water: 80-90%) | Taiwan | Lit | 840.00 | 3,864.00 | 4.60 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution works to improve adhesion and surface quality, used in motherboard manufacturing technology (CuSO4: 10-20% , Sulfuric acid <1 % , Water: 80-90%) | Taiwan | Lit | 660.00 | 3,036.00 | 4.60 | View Importer | View Supplier |
| 24/Jan/2019 | 38249999 | Water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry - cuposit TM 253A-2 electroless copper | Taiwan | Lit | 1,280.00 | 3,388.36 | 2.65 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution works to improve adhesion and surface quality, used in motherboard manufacturing technology (CuSO4: 10-20% , Sulfuric acid <1 % , Water: 80-90%) | Taiwan | Lit | 1,840.00 | 8,464.00 | 4.60 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT 6540C REDUCER / 20L solution (contains 70-80% water and Acetic acid 20-30%) , which enhances nickel plating speed , surface quality sp, used in boron manufacturing technology electronic circuit | China | Lit | 100.00 | 590.00 | 5.90 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | Water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry - cuposit TM 253A-2 electroless copper (20L / T) | Taiwan | Lit | 2,000.00 | 6,800.00 | 3.40 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | Cuposit (TM) 253S Electroless Copper - water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry | Japan | Lit | 100.00 | 956.14 | 9.56 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT P-6550C (VN) / 20L without water 70 -80% and Organic salt 20 - 30%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 320.00 | 2,134.74 | 6.67 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT P-6550A ELESS CU / 20L without water 80-90% and Copper sulfate 10-20% , Sulfuric acid <1%. Used to improve adhesion and surface quality of products. Used in electronic circuit manufacturing technology | Taiwan | Lit | 3,000.00 | 10,450.98 | 3.48 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | Water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry - cuposit TM 253A-2 electroless copper | Taiwan | Lit | 6,400.00 | 16,769.41 | 2.62 | View Importer | View Supplier |
