| Date | HS Code | Product Description | Origin Country | Unit | Quantity | Total Value [USD] | Unit Price [USD] | Importer Name | Supplier Name |
|---|---|---|---|---|---|---|---|---|---|
| 30/Mar/2020 | 38249999 | Preparations used in plating COPPER GLEAM ST-901BM (water 80-90%; Oxyalkylene Polymer 1-10%; Copper sulfate 0.1-1%; Sulfuric acid <1%) | Japan | liter | 340.00 | 3,065.32 | 9.02 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | CIRCUPOSIT P-6550C (VN) / 20L without water 70 -80% and Organic salt 20 - 30%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology. | Japan | liter | 640.00 | 4,622.06 | 7.22 | View Importer | View Supplier |
| 16/Mar/2020 | 38249999 | KC626 gold plated solution - used to beautify metal surfaces (Ingredients: Organic acid: 10%; Organic acid salt: 10%; Water: 80%) | Japan | liter | 10.00 | 591.82 | 59.18 | View Importer | View Supplier |
| 07/Mar/2020 | 38249999 | Preparations used in plating COPPER GLEAM ST-901BM (water 80-90%; Oxyalkylene Polymer 1-10%; Copper sulfate 0.1-1%; Sulfuric acid <1%) | Japan | liter | 60.00 | 900.00 | 15.00 | View Importer | View Supplier |
