| 30/Mar/2020 | 38249999 | Preparations used in plating COPPER GLEAM ST-901BM (water 80-90%; Oxyalkylene Polymer 1-10%; Copper sulfate 0.1-1%; Sulfuric acid <1%) | Japan | liter | 340.00 | 3,065.32 | 9.02 | View Importer | View Supplier |
| 26/Mar/2020 | 38249999 | NPL194 # & Preparations used in plating COPPER GLEAM ST-901BM (H2SO4 <1%, Copper Sulfate 0.1% << 1%, Water 80% - 90%) | Japan | ml | 160,000.00 | 1,673.60 | 0.01 | View Importer | View Supplier |
| 25/Mar/2020 | 38249999 | HAT-DA # & Granules (Composition: 80% Calcium carbonate, 20% Polypropylene) used as additives for plastic products | Japan | kg | 4,000.00 | 5,000.00 | 1.25 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | CIRCUPOSIT P-6550C (VN) / 20L without water 70 -80% and Organic salt 20 - 30%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology. | Japan | liter | 640.00 | 4,622.06 | 7.22 | View Importer | View Supplier |
| 16/Mar/2020 | 38249999 | KC626 gold plated solution - used to beautify metal surfaces (Ingredients: Organic acid: 10%; Organic acid salt: 10%; Water: 80%) | Japan | liter | 10.00 | 591.82 | 59.18 | View Importer | View Supplier |
| 16/Mar/2020 | 38249999 | Solution added to gold-plated solution KC626 - used to beautify the metal surface (Ingredients: Organic acid: 2%; Iron compound: 8%; Organic acid salt: 10%; Water: 80%) (1UN = 100ml). | Japan | bottle / jar / tube | 1.00 | 85.23 | 85.23 | View Importer | View Supplier |
| 07/Mar/2020 | 38249999 | Preparations used in plating COPPER GLEAM ST-901BM (water 80-90%; Oxyalkylene Polymer 1-10%; Copper sulfate 0.1-1%; Sulfuric acid <1%) | Japan | liter | 60.00 | 900.00 | 15.00 | View Importer | View Supplier |
| 02/Mar/2020 | 38249999 | ADD9033 # & Color-stabilizing powders (JF-80 UV Powder) (using candles) | Japan | kg | 20.00 | 1,017.11 | 50.86 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Cuposit (TM) 253S Electroless Copper - water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry (20L / carton) | Japan | Lit | 60.00 | 754.20 | 12.57 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | Chemicals used for plating tanks , additive TR-175JA (containing chromium4 (III) sulphate: 1-10% , CoSO4 Cobalt (III) sulfate: 1-10% , H2O water: 80 -90%) , 20kg / can. CAS: 10101-53-8. | Japan | Kg | 60.00 | 487.15 | 8.12 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | Chemicals used for plating tanks , additive TR-185HK (containing CoSO4 Cobalt (III) Sulfate: 10-20% , H2O water: 80-90%) , 18kg / can. CAS: 10026-24-1 | Japan | Kg | 54.00 | 403.45 | 7.47 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | Chemicals used for plating tanks , additive TR-175JH (containing CrSO4 chromium (III) sulfate: 10-20% , CoSO4 Cobalt (III) sulfate: 1-10% , H2O water: 70 -80%) , 20kg / can. CAS: 10101-53-8 | Japan | Kg | 140.00 | 1,408.77 | 10.06 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | Chemicals used for plating tanks , additive TR-185K (containing CoSO4 Cobalt (III) Sulfate: 10-20% , H2O water: 80-90%) , 18kg / can. CAS 10026-22-9 | Japan | Kg | 54.00 | 345.15 | 6.39 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | Cuposit (TM) 253S Electroless Copper - water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry | Japan | Lit | 100.00 | 956.14 | 9.56 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT P-6550C (VN) / 20L without water 70 -80% and Organic salt 20 - 30%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 320.00 | 2,134.74 | 6.67 | View Importer | View Supplier |
