| 30/Mar/2020 | 38249999 | Preparations used in plating COPPER GLEAM ST-901BM (water 80-90%; Oxyalkylene Polymer 1-10%; Copper sulfate 0.1-1%; Sulfuric acid <1%) | Japan | liter | 340.00 | 3,065.32 | 9.02 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020132 # & MICROFILL (TM) THF CARRIER SOLUTION contains water 80-90%; Sulfuric acid <1%; Copper sulfate <1%; Oxyalkylene Polymer 1-10% used in electroplating technology | Taiwan | liter | 800.00 | 36,032.00 | 45.04 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | CIRCUPOSIT P-6550C (VN) / 20L without water 70 -80% and Organic salt 20 - 30%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology. | Japan | liter | 640.00 | 4,622.06 | 7.22 | View Importer | View Supplier |
| 20/Mar/2020 | 38249999 | CIRCUPOSIT P-6550A ELESS CU / 20L water-resistant 80-90%, Copper sulfate 10-20%, Sulfuric acid <1%. Effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology | Taiwan | liter | 6,000.00 | 21,127.54 | 3.52 | View Importer | View Supplier |
| 19/Mar/2020 | 38249999 | CM-00046 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution is used to improve adhesion and surface quality of products used in industrial equipment (Copper sulfate: 10-20%, Sulfuric acid < 1%, Water: 80-90%) | Taiwan | liter | 320.00 | 1,472.00 | 4.60 | View Importer | View Supplier |
| 16/Mar/2020 | 38249999 | KC626 gold plated solution - used to beautify metal surfaces (Ingredients: Organic acid: 10%; Organic acid salt: 10%; Water: 80%) | Japan | liter | 10.00 | 591.82 | 59.18 | View Importer | View Supplier |
| 16/Mar/2020 | 38249999 | CIRCUPOSIT P-6550A ELESS CU / 20L without water 80-90%, Copper sulfate 10-20%, Sulfuric acid <1%. Has the effect of improving the adhesion and surface quality of the product. Used in electronics manufacturing technology | Taiwan | liter | 9,000.00 | 31,753.76 | 3.53 | View Importer | View Supplier |
| 13/Mar/2020 | 38249999 | CM-00046 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution is used to improve adhesion and surface quality of products used in industrial equipment (Copper sulfate: 10-20%, Sulfuric acid < 1%, Water: 80-90%) | Taiwan | liter | 1,280.00 | 5,888.00 | 4.60 | View Importer | View Supplier |
| 12/Mar/2020 | 38249999 | Water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0.1-1% used in plating industry - cuposit TM 253A-2 electroless copper (20L / T) under section 10 tk 102496191931 / A12 dated February 22, 2019 | Taiwan | liter | 4.44 | 15.10 | 3.40 | View Importer | View Supplier |
| 12/Mar/2020 | 38249999 | 0 # & MLB Promoter 213B-1 solution contains water 70-80%; Sodium hydroxide 20-30% - used in electronics industry, new 100% | China | liter | 960.00 | 2,630.40 | 2.74 | View Importer | View Supplier |
| 12/Mar/2020 | 38249999 | SANISOL C-80 - Water treatment for domestic use (200 liters / Drum), CAS Code: 63449-41-2, 100% new, (Not on the list of Decree No. 113 / ND-CP) | Thailand | liter | 2,200.00 | 10,450.00 | 4.75 | View Importer | View Supplier |
| 12/Mar/2020 | 38249999 | CM-00046 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution is used to improve adhesion and surface quality of products used in industrial equipment (Copper sulfate: 10-20%, Sulfuric acid < 1%, Water: 80-90%) | Taiwan | liter | 1,280.00 | 5,888.00 | 4.60 | View Importer | View Supplier |
| 07/Mar/2020 | 38249999 | Preparations used in plating COPPER GLEAM ST-901BM (water 80-90%; Oxyalkylene Polymer 1-10%; Copper sulfate 0.1-1%; Sulfuric acid <1%) | Japan | liter | 60.00 | 900.00 | 15.00 | View Importer | View Supplier |
| 05/Mar/2020 | 38249999 | CM-00046 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution is used to improve adhesion and surface quality of products used in industrial equipment (Copper sulfate: 10-20%, Sulfuric acid < 1%, Water: 80-90%) | Taiwan | liter | 1,280.00 | 5,888.00 | 4.60 | View Importer | View Supplier |
