| 31/Jan/2019 | 38249999 | Cuposit (TM) 253S Electroless Copper - water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry (20L / carton) | Japan | Lit | 60.00 | 754.20 | 12.57 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | Cuposit (TM) 253S Electroless Copper - water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry | Japan | Lit | 100.00 | 956.14 | 9.56 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT P-6550C (VN) / 20L without water 70 -80% and Organic salt 20 - 30%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 320.00 | 2,134.74 | 6.67 | View Importer | View Supplier |
| 15/Jan/2019 | 38249999 | Cuposit (TM) 253S Electroless Copper - water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry (20L / carton) | Japan | Lit | 300.00 | 3,771.00 | 12.57 | View Importer | View Supplier |
| 04/Jan/2019 | 38249999 | Cuposit (TM) 253S Electroless Copper - water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry | Japan | Lit | 60.00 | 573.85 | 9.56 | View Importer | View Supplier |
| 04/Jan/2019 | 38249999 | CIRCUPOSIT P-6550C (VN) / 20L without water 70 -80% and Organic salt 20 - 30%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 300.00 | 2,002.09 | 6.67 | View Importer | View Supplier |
| 03/Jan/2019 | 38249999 | Cuposit (TM) 253S Electroless Copper - water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry (20L / carton) | Japan | Lit | 60.00 | 754.20 | 12.57 | View Importer | View Supplier |
