| Date | HS Code | Product Description | Origin Country | Unit | Quantity | Total Value [USD] | Unit Price [USD] | Importer Name | Supplier Name |
|---|---|---|---|---|---|---|---|---|---|
| 05/Mar/2020 | 84798939 | 0 # & Temporarily presses the s / p layers (plastic, copper) together before the heat press for printed circuits, Model: HBM-02. 220V 50Hz 3P. (USED Bonding M / C (HBM-02) (S / N: HBM-K01)), produced in 2018, manufacturer: SUPEX BNP | Korea (Republic) | set | 1.00 | 25,514.00 | 25,514.00 | View Importer | View Supplier |
| 05/Mar/2020 | 84798939 | 0 # & Temporarily presses the s / p layers (plastic, copper) together before the heat press process for printed circuits, Model: HBM-02. 220V 50Hz 3P. (USED Bonding M / C (HBM-02) (S / N: HBM-K02)), produced in 2018, manufacturer: SUPEX BNP | Korea (Republic) | set | 1.00 | 25,514.00 | 25,514.00 | View Importer | View Supplier |
