| Date | HS Code | Product Description | Origin Country | Unit | Quantity | Total Value [USD] | Unit Price [USD] | Importer Name | Supplier Name |
|---|---|---|---|---|---|---|---|---|---|
| 03/Mar/2020 | 35069900 | Resin glue used to glue electronic components together PEGAPRO HC-H661S, 0201-003367 (0.12kg / vial). New 100% | Korea (Republic) | kg | 8.40 | 5,544.00 | 660.00 | View Importer | View Supplier |
| 09/Jan/2019 | 35061000 | MATT AD-1331FL (modified epoxy resin , polythiol resin , calcite , talc , hydrated alumina) with a capacity of 10cc / vial applied to the product for the purpose of connecting components together, new products: 100% | Korea (Republic) | Piece/Pcs | 1,150.00 | 30,498.00 | 26.52 | View Importer | View Supplier |
