30/Mar/2020 | 85429000 | SHG89XA40001 # & Semiconductor chips used in semiconductor chip manufacturing technology (WAFER), 200um thick (+ -) 10um, CSP stage, SHG89XA40001 | Korea (Republic) | piece/pcs | 627,744.00 | 7,532.93 | 0.01 | View Importer | View Supplier |
27/Mar/2020 | 85429000 | SHG56BA00001 # & Semiconductor chips used in semiconductor chip manufacturing technology (WAFER) with thickness of 200um (+ -) 10um, stage CSP, SHG56BA00001 | Korea (Republic) | piece/pcs | 865,694.00 | 8,656.94 | 0.01 | View Importer | View Supplier |
27/Mar/2020 | 85429000 | SHG89XA40001 # & Semiconductor chips used in semiconductor chip manufacturing technology (WAFER), 200um thick (+ -) 10um, CSP stage, SHG89XA40001 | Korea (Republic) | piece/pcs | 706,212.00 | 8,474.54 | 0.01 | View Importer | View Supplier |
27/Mar/2020 | 85429000 | SHG56BA00001 # & Semiconductor chips used in semiconductor chip manufacturing technology (WAFER) with thickness of 200um (+ -) 10um, stage CSP, SHG56BA00001 | Korea (Republic) | piece/pcs | 198,546.00 | 1,985.46 | 0.01 | View Importer | View Supplier |
27/Mar/2020 | 85429000 | SWG42EPM0H01 # & Semiconductor chips used in semiconductor chip manufacturing technology (WAFER (FAB)), 350um thick (+ -) 10um; SWG42EPM0H01 | Korea (Republic) | piece/pcs | 181,464.00 | 5,080.99 | 0.03 | View Importer | View Supplier |
27/Mar/2020 | 85429000 | SRG52BPM0H01 # & Semiconductor chips used in semiconductor chip manufacturing technology (WAFER (FAB)), 350um thick (+ -) 10um; SRG52BPM0H01 | Korea (Republic) | piece/pcs | 45,498.00 | 1,137.45 | 0.03 | View Importer | View Supplier |
23/Mar/2020 | 85429000 | SHG60ATS0H01 # & Semiconductor chips used in semiconductor chip manufacturing technology (WAFER (FAB)), 350um thick (+ -) 10um; SHG60ATS0H01 | Korea (Republic) | piece/pcs | 393,260.00 | 11,011.28 | 0.03 | View Importer | View Supplier |
23/Mar/2020 | 85429000 | SRG52BPM0H01 # & Semiconductor chips used in semiconductor chip manufacturing technology (WAFER (FAB)), 350um thick (+ -) 10um; SRG52BPM0H01 | Korea (Republic) | piece/pcs | 75,830.00 | 1,895.75 | 0.03 | View Importer | View Supplier |
23/Mar/2020 | 85429000 | SHG56DJ20H01 # & Semiconductor chip used in semiconductor chip manufacturing technology (WAFER), 200um thick (+ -) 10um; stage CSP, SHG56DJ20H01 | Korea (Republic) | piece/pcs | 496,356.00 | 3,970.85 | 0.01 | View Importer | View Supplier |
23/Mar/2020 | 85429000 | SW742AL60H01 # & Semiconductor chips used in semiconductor chip manufacturing technology (WAFER (FAB)), 200um thick (+ -) 10um; SW742AL60H01 | Korea (Republic) | piece/pcs | 78,806.00 | 3,191.64 | 0.04 | View Importer | View Supplier |
23/Mar/2020 | 85429000 | SR806DL50H01 # & Semiconductor chips used in semiconductor chip manufacturing technology (WAFER (FAB)), 200um thick (+ -) 10um; SR806DL50H01 | Korea (Republic) | piece/pcs | 287,079.00 | 11,626.70 | 0.04 | View Importer | View Supplier |
23/Mar/2020 | 85429000 | SRG42GP10H01 # & Semiconductor chips used in semiconductor chip manufacturing technology (WAFER (FAB)), 200um thick (+ -) 10um; SRG42GP10H01 | Korea (Republic) | piece/pcs | 144,077.00 | 3,025.62 | 0.02 | View Importer | View Supplier |
23/Mar/2020 | 85429000 | SHG60ATS0H01 # & Semiconductor chips used in semiconductor chip manufacturing technology (WAFER (FAB)), 350um thick (+ -) 10um; SHG60ATS0H01 | Korea (Republic) | piece/pcs | 112,360.00 | 3,146.08 | 0.03 | View Importer | View Supplier |
23/Mar/2020 | 85429000 | SWG42EPM0H01 # & Semiconductor chips used in semiconductor chip manufacturing technology (WAFER (FAB)), 350um thick (+ -) 10um; SWG42EPM0H01 | Korea (Republic) | piece/pcs | 287,318.00 | 8,044.90 | 0.03 | View Importer | View Supplier |
23/Mar/2020 | 85429000 | SRG52BPM0H01 # & Semiconductor chips used in semiconductor chip manufacturing technology (WAFER (FAB)), 350um thick (+ -) 10um; SRG52BPM0H01 | Korea (Republic) | piece/pcs | 68,247.00 | 1,706.18 | 0.03 | View Importer | View Supplier |