| 31/Jan/2019 | 38249999 | Microfill EVF Brightener Solution contains 90-99% water, Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology (20L / T-1,515) kg) | Taiwan | Lit | 1,500.00 | 21,150.00 | 14.10 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-505kg) | Taiwan | Lit | 500.00 | 9,410.00 | 18.82 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | CIRCUPOSIT 6530 CAT (VN) / 20L without water> 98% and Inorganic salt <1%. It helps to promote the process of forming the copper layer inside the hole of the board. In electronic circuit manufacturing technology | Japan | Lit | 1,280.00 | 51,013.10 | 39.85 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 1,100.00 | 7,091.95 | 6.45 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-303kg) | Taiwan | Lit | 300.00 | 5,646.00 | 18.82 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 (TM) solution contains Water 90-99% , Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology ( 20L / T-404kg) | Japan | Lit | 400.00 | 14,864.00 | 37.16 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Microfill EVF Brightener Solution contains 90-99% water, Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology (20L / T-303kg ) | Taiwan | Lit | 300.00 | 4,230.00 | 14.10 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | Chemical preparations used in plating technology with main ingredients are aminoethanolamine and BLACKHOLE AF CONDITIONER. 100% new goods (unit price of goods is USD 56.07 = VND 1298301) | Taiwan | Lit | 400.00 | 22,428.00 | 56.07 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-606kg) | Taiwan | Lit | 600.00 | 11,292.00 | 18.82 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 (TM) solution contains Water 90-99% , Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology ( 20L / T-303kg) | Japan | Lit | 300.00 | 11,148.00 | 37.16 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution works to improve adhesion and surface quality, used in motherboard manufacturing technology (CuSO4: 10-20% , Sulfuric acid <1 % , Water: 80-90%) | Taiwan | Lit | 840.00 | 3,864.00 | 4.60 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution works to improve adhesion and surface quality, used in motherboard manufacturing technology (CuSO4: 10-20% , Sulfuric acid <1 % , Water: 80-90%) | Taiwan | Lit | 660.00 | 3,036.00 | 4.60 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 021 # & Chemical products used in plating technology (DEPLATER ST) | Japan | Lit | 200.00 | 1,023.14 | 5.12 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 138 # & Chemical products used in plating technology (CUPSOL-M) | Japan | Lit | 200.00 | 1,724.75 | 8.62 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 135 # & Chemical products used in plating technology (CUPSOL-A) | Japan | Lit | 120.00 | 1,191.36 | 9.93 | View Importer | View Supplier |
