| 31/Jan/2019 | 38249999 | Microfill EVF Brightener Solution contains 90-99% water, Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology (20L / T-1,515) kg) | Taiwan | Lit | 1,500.00 | 21,150.00 | 14.10 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-505kg) | Taiwan | Lit | 500.00 | 9,410.00 | 18.82 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-303kg) | Taiwan | Lit | 300.00 | 5,646.00 | 18.82 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Microfill EVF Brightener Solution contains 90-99% water, Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology (20L / T-303kg ) | Taiwan | Lit | 300.00 | 4,230.00 | 14.10 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | Chemical preparations used in plating technology with main ingredients are aminoethanolamine and BLACKHOLE AF CONDITIONER. 100% new goods (unit price of goods is USD 56.07 = VND 1298301) | Taiwan | Lit | 400.00 | 22,428.00 | 56.07 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-606kg) | Taiwan | Lit | 600.00 | 11,292.00 | 18.82 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution works to improve adhesion and surface quality, used in motherboard manufacturing technology (CuSO4: 10-20% , Sulfuric acid <1 % , Water: 80-90%) | Taiwan | Lit | 840.00 | 3,864.00 | 4.60 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution works to improve adhesion and surface quality, used in motherboard manufacturing technology (CuSO4: 10-20% , Sulfuric acid <1 % , Water: 80-90%) | Taiwan | Lit | 660.00 | 3,036.00 | 4.60 | View Importer | View Supplier |
| 24/Jan/2019 | 38249999 | Microfill EVF Brightener Solution contains 90-99% Water, Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology | Taiwan | Lit | 640.00 | 5,149.63 | 8.05 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution works to improve adhesion and surface quality, used in motherboard manufacturing technology (CuSO4: 10-20% , Sulfuric acid <1 % , Water: 80-90%) | Taiwan | Lit | 1,840.00 | 8,464.00 | 4.60 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 solution contains 90-99% water, Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology | Taiwan | Lit | 1,280.00 | 30,514.57 | 23.84 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT P-6550A ELESS CU / 20L without water 80-90% and Copper sulfate 10-20% , Sulfuric acid <1%. Used to improve adhesion and surface quality of products. Used in electronic circuit manufacturing technology | Taiwan | Lit | 3,000.00 | 10,450.98 | 3.48 | View Importer | View Supplier |
| 17/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution works to improve adhesion and surface quality, used in motherboard manufacturing technology (CuSO4: 10-20% , Sulfuric acid <1 % , Water: 80-90%) | Taiwan | Lit | 440.00 | 2,024.00 | 4.60 | View Importer | View Supplier |
| 17/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution works to improve adhesion and surface quality, used in motherboard manufacturing technology (CuSO4: 10-20% , Sulfuric acid <1 % , Water: 80-90%) | Taiwan | Lit | 500.00 | 2,300.00 | 4.60 | View Importer | View Supplier |
| 14/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution works to improve adhesion and surface quality, used in motherboard manufacturing technology (CuSO4: 10-20% , Sulfuric acid <1 % , Water: 80-90%) | Taiwan | Lit | 640.00 | 2,944.00 | 4.60 | View Importer | View Supplier |
