| 30/Jan/2019 | 38249999 | CIRCUPOSIT 6530 CAT (VN) / 20L without water> 98% and Inorganic salt <1%. It helps to promote the process of forming the copper layer inside the hole of the board. In electronic circuit manufacturing technology | Japan | Lit | 1,280.00 | 51,013.10 | 39.85 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 1,100.00 | 7,091.95 | 6.45 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 (TM) solution contains Water 90-99% , Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology ( 20L / T-404kg) | Japan | Lit | 400.00 | 14,864.00 | 37.16 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 (TM) solution contains Water 90-99% , Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology ( 20L / T-303kg) | Japan | Lit | 300.00 | 11,148.00 | 37.16 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 021 # & Chemical products used in plating technology (DEPLATER ST) | Japan | Lit | 200.00 | 1,023.14 | 5.12 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 138 # & Chemical products used in plating technology (CUPSOL-M) | Japan | Lit | 200.00 | 1,724.75 | 8.62 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 135 # & Chemical products used in plating technology (CUPSOL-A) | Japan | Lit | 120.00 | 1,191.36 | 9.93 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 136 # & Chemical products used in plating technology (CUPSOL-B) | Japan | Lit | 200.00 | 2,372.39 | 11.86 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT 6530 CAT (VN) / 20L without water> 98% and Inorganic salt <1%. It helps to promote the process of forming the copper layer inside the hole of the board. In electronic circuit manufacturing technology | Japan | Lit | 400.00 | 15,779.37 | 39.45 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT P-6550C (VN) / 20L without water 70 -80% and Organic salt 20 - 30%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 320.00 | 2,134.74 | 6.67 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 3,200.00 | 19,965.44 | 6.24 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | CUPOSIT N (VN) / 20L without water 85-95% , Nickel sulfate 1-10% , and Sulfuric acid 1-10%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology | Japan | Lit | 320.00 | 3,252.23 | 10.16 | View Importer | View Supplier |
| 15/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 (TM) solution contains Water 90-99% , Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology ( 20L / T-303kg) | Japan | Lit | 300.00 | 11,148.00 | 37.16 | View Importer | View Supplier |
| 04/Jan/2019 | 38249999 | CIRCUPOSIT 6530 CAT (VN) / 20L without water> 98% and Inorganic salt <1%. It has the effect of promoting the process of forming the copper layer inside the board's hole wall. In electronic circuit manufacturing technology | Japan | Lit | 1,920.00 | 75,745.47 | 39.45 | View Importer | View Supplier |
| 04/Jan/2019 | 38249999 | CIRCUPOSIT P-6550C (VN) / 20L without water 70 -80% and Organic salt 20 - 30%. Has the effect of improving adhesion and surface quality of products. Used in electronic board manufacturing technology. | Japan | Lit | 300.00 | 2,002.09 | 6.67 | View Importer | View Supplier |
