| 31/Mar/2020 | 38101000 | Solder paste LFM-48U TM-HP (ST) 30cc / pc, 40g for soldering electronic circuit boards, main TP: Sn CAS 7440-31-5 (82.99%), Ag CAS 7440-22-4 (2.58 %), Cu CAS 7440-50-8 (0.43%). new 100%. | Japan | bottle / jar / tube | 20.00 | 641.13 | 32.06 | View Importer | View Supplier |
| 11/Mar/2020 | 38101000 | Solder paste LFM-48U TM-HP (ST) 120gram / pc (main ingredient: Sn 7440-31-5 (82.99%), Ag 7440-22-4 (2.58%), Cu 7440-50-8 ( 0.43%)), used for soldering electronic circuit boards, new goods 100% .. | Japan | piece/pcs | 20.00 | 693.27 | 34.66 | View Importer | View Supplier |
| 07/Jan/2019 | 38249999 | Chemical preparations used in plating industry with Ethylenediamine content of 50% used to peel the broken nickel plating layer , symbol of ST-411B * , 20L / polybtl , 100% new | Japan | Kg | 800.00 | 4,688.69 | 5.86 | View Importer | View Supplier |
