| 30/Mar/2020 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology. | Japan | liter | 1,280.00 | 9,157.80 | 7.15 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | CUPOSIT N (VN) / 20L without water 85 - 95%, Nickel sulfate 1 - 10%, and Sulfuric acid 1- 10%. Has the effect of improving adhesion and surface quality of products. Capacitive in the technology of manufacturing electric circuit boards | Japan | liter | 320.00 | 3,461.45 | 10.82 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | CIRCUPOSIT P-6550C (VN) / 20L without water 70 -80% and Organic salt 20 - 30%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology. | Japan | liter | 640.00 | 4,622.06 | 7.22 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology. | Japan | liter | 1,280.00 | 8,759.36 | 6.84 | View Importer | View Supplier |
| 20/Mar/2020 | 38249999 | COSMO K-1 COPPER PLATINAL ADDITIVES, FOR CREATING RESPONSE TO HELP GOOD GRINDING COPPER PLATED IN SPINDLE PRODUCTS. ASSESSED AT TTPTPLMN NO 1450 | Japan | liter | 760.00 | 6,384.00 | 8.40 | View Importer | View Supplier |
| 20/Mar/2020 | 38249999 | COSMO K-2 COPPER PLUG ADDITIVE, USED TO CREATE REACTIVITY TO HELP GOOD GRINDING COPPER PLATED IN SPINDLE PRODUCTS. ASSESSED AT TTPTPLMN NO 1450 | Japan | liter | 760.00 | 6,384.00 | 8.40 | View Importer | View Supplier |
| 19/Mar/2020 | 38249999 | CM-00066 # & CUPOSIT N solution contains 85-95% water, NiSO4 1-10%, H2SO4: 1- 10%, which improve the adhesion and surface quality of products, in electronic circuit boards manufacturing | Japan | liter | 320.00 | 4,416.00 | 13.80 | View Importer | View Supplier |
| 19/Mar/2020 | 38249999 | CM-00048 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15-25%, which enhance the adhesion and surface quality of products, in electronic circuit boards manufacturing | Japan | liter | 640.00 | 5,440.00 | 8.50 | View Importer | View Supplier |
| 16/Mar/2020 | 38249999 | Preparations for finishing the surface of TOP RIP AZ-2 coating (20L / Can) (TP: Ethylene diamine 19%, Triethanolamine 9%, Organic compound 5-10%, Water). 100% new products | Japan | liter | 20.00 | 270.00 | 13.50 | View Importer | View Supplier |
| 13/Mar/2020 | 38249999 | CM-00048 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15-25%, which enhance the adhesion and surface quality of products, in electronic circuit boards manufacturing | Japan | liter | 640.00 | 5,440.00 | 8.50 | View Importer | View Supplier |
| 12/Mar/2020 | 38249999 | CM-00048 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15-25%, which enhance the adhesion and surface quality of products, in electronic circuit boards manufacturing | Japan | liter | 280.00 | 2,380.00 | 8.50 | View Importer | View Supplier |
| 12/Mar/2020 | 38249999 | CM-00048 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15-25%, which enhance the adhesion and surface quality of products, in electronic circuit boards manufacturing | Japan | liter | 1,000.00 | 8,500.00 | 8.50 | View Importer | View Supplier |
| 12/Mar/2020 | 38249999 | 07020102 # & MU-2 Plating cleaning products (20LTS / CAN), main ingredients are sodium saccharin, sodium dioctyl sulfosuccinate and additives, liquid, Goods manufactured by OKUNO- Japan, 100% new | Japan | liter | 20.00 | 380.00 | 19.00 | View Importer | View Supplier |
| 10/Mar/2020 | 38249999 | Additives used in electroplating technology AD372 (TP: Cobalt salt 1%, additives 4% and 95% Water) New products 100% | Japan | liter | 5.00 | 552.25 | 110.45 | View Importer | View Supplier |
| 10/Mar/2020 | 38249999 | Additives used in electroplating technology AD376 (TP: Anionic Surfactant 1%, additives 2% and Water 97%) New products 100% | Japan | liter | 5.00 | 552.25 | 110.45 | View Importer | View Supplier |
