| 06/Mar/2020 | 29161410 | 0 # & Chemical mixed with cast powder for checking printed circuit boards, (1.2KG / Vial). (Acryl Mold Liquid (jar size: phi 80 * 240) mm) (CG020100044), 100% new | Korea (Republic) | bottle / jar / tube | 65.00 | 3,188.17 | 49.05 | View Importer | View Supplier |
| 06/Mar/2020 | 29161490 | 0 # & Chemicals s / d to resist oxidized copper after Etching or printed circuit board copper plating (Triethanol amine 3%, 2-Methyl-2,4-pentanediol 25%, compound 67%, Organic nitrogen 25%) (TOP RINSE CU-5) (SB030100051) | Japan | liter | 504.00 | 13,083.29 | 25.96 | View Importer | View Supplier |
| 06/Mar/2020 | 29161490 | 0 # & Chemicals s / d to resist oxidized copper after Etching or printed circuit board copper plating (Triethanol amine 3%, 2-Methyl-2,4-pentanediol 25%, compound 67%, Organic nitrogen 25%) (TOP RINSE CU-5) (SB030100051) | Japan | liter | 126.00 | 3,245.79 | 25.76 | View Importer | View Supplier |
| 06/Mar/2020 | 29161490 | 0 # & Chemicals s / d to resist oxidized copper after Etching or printed circuit board copper plating (Triethanol amine 3%, 2-Methyl-2,4-pentanediol 25%, compound 67%, Organic nitrogen 25%) (TOP RINSE CU-5) (SB030100051) | Japan | liter | 414.00 | 10,664.72 | 25.76 | View Importer | View Supplier |
| 05/Mar/2020 | 29161410 | 0 # & Casting powder for checking printed circuit boards, 2.9KGM / 1UNA. (Acryl Mold Powder (phi 210 * 180) mm) (CG020100004), new 100% | Korea (Republic) | bottle / jar / tube | 26.00 | 3,272.39 | 125.86 | View Importer | View Supplier |
| 14/Jan/2019 | 29161490 | 0 # & Chemicals used to resist oxidation of copper after Ethcing or copper plating of printed circuit boards. (TOP RINSE CU-5 (240 * 240 * 350)) (MA040405186) , 100% new | Japan | Lit | 90.00 | 2,427.84 | 26.98 | View Importer | View Supplier |
