| 30/Mar/2020 | 85340020 | CFP1661HQ # & Duplex printed circuit board model: PCB CFP-1661-H-000, manufacturer: check on used to assemble the production of mobile phone headset boards. New 100%. | HongKong | piece/pcs | 35,200.00 | 418.88 | 0.01 | View Importer | View Supplier |
| 30/Mar/2020 | 85340020 | EHS61N (EP) # & EHS-61-Ver1.2 printed circuit board (Don't use bead) parameters: FR-4.0.6t, manufacturer: check on used to assemble manufacturing mobile phone headsets. New 100% | HongKong | piece/pcs | 81,900.00 | 794.43 | 0.01 | View Importer | View Supplier |
| 30/Mar/2020 | 85340020 | Duplex printed circuit board model: PCB 744229 Rev1.0, manufacturer: Check on for assembling and manufacturing mobile phone headset boards. New 100% | HongKong | piece/pcs | 36,400.00 | 393.12 | 0.01 | View Importer | View Supplier |
| 27/Mar/2020 | 85340020 | CFP2037HQ # & Duplex printed circuit board model: PCB CFP-2037-H-000 used to assemble and manufacture mobile phone headsets. 100% new goods, of line 4, tk: 103097970030 | HongKong | piece/pcs | 500,000.00 | 4,900.00 | 0.01 | View Importer | View Supplier |
| 23/Mar/2020 | 85340020 | CFP2074HQ # & Duplex printed circuit board: PCB CFP-2074-H-000, specifications: 0.65t, 2layer, manufacturer: CHeck on, used to assemble the production of mobile phone headset boards. New 100% | HongKong | piece/pcs | 709,154.00 | 6,949.71 | 0.01 | View Importer | View Supplier |
| 23/Mar/2020 | 85340020 | EHS61N (EP) # & EHS-61-Ver1.2 printed circuit board (Don't use bead) parameters: FR-4.0.6t, manufacturer: check on used to assemble manufacturing mobile phone headsets. New 100% | HongKong | piece/pcs | 518,400.00 | 5,028.48 | 0.01 | View Importer | View Supplier |
| 13/Mar/2020 | 85340020 | EP044H2R0HQ # & Duplex printed circuit board model: EP044H2-R0, parameters: 2 layers, FR4,0.6t, manufacturer: Check on for assembling and manufacturing mobile phone headsets. New 100%. | HongKong | piece/pcs | 52,800.00 | 660.00 | 0.01 | View Importer | View Supplier |
| 13/Mar/2020 | 85340020 | EHS61N (EP) # & EHS-61-Ver1.2 printed circuit board (Don't use bead) parameters: FR-4.0.6t, manufacturer: check on used to assemble manufacturing mobile phone headsets. New 100% | HongKong | piece/pcs | 568,750.00 | 5,516.88 | 0.01 | View Importer | View Supplier |
| 09/Mar/2020 | 85340020 | EHS64 (EP) # & Duplex printed circuit board model: EHS-64 Ver1.4.2, manufacturer: Check on used to assemble the production of mobile phone headset boards. New 100% | HongKong | piece/pcs | 422,555.00 | 5,155.17 | 0.01 | View Importer | View Supplier |
| 28/Jan/2019 | 85340020 | EHS64 (EP) # & PCB printed circuit board EHS-64 Ver1.4.2 used to assemble manufacturing mobile phone headsets. New 100% | HongKong | Piece/Pcs | 433,012.00 | 5,282.75 | 0.01 | View Importer | View Supplier |
| 28/Jan/2019 | 85340020 | EHS61N (EP) # & Printed Circuit Board EHS-61-Ver1.2 (Don't use bead) for assembling and manufacturing mobile phone headsets. New 100% | HongKong | Piece/Pcs | 2,045,092.00 | 19,837.39 | 0.01 | View Importer | View Supplier |
| 28/Jan/2019 | 85340020 | PCB510898HQ # & PCB 510898 printed circuit board used to assemble and manufacture mobile phone headsets. New 100%. | HongKong | Piece/Pcs | 47,866.00 | 516.95 | 0.01 | View Importer | View Supplier |
| 28/Jan/2019 | 85340020 | PCB747284HQ # & PCB printed board 747284 used to assemble and manufacture mobile phone headsets. New 100%. | HongKong | Piece/Pcs | 1,403,223.00 | 15,154.81 | 0.01 | View Importer | View Supplier |
| 28/Jan/2019 | 85340020 | CFP2037HQ # & PCB printed circuit board CFP-2037-H-000 is used to assemble and produce mobile phone headsets. New 100% | HongKong | Piece/Pcs | 607,526.00 | 6,075.26 | 0.01 | View Importer | View Supplier |
| 10/Jan/2019 | 85340020 | EHS64 (EP) # & PCB printed circuit board EHS-64 Ver1.4.2 used to assemble manufacturing mobile phone headsets. New 100% | HongKong | Piece/Pcs | 495,000.00 | 6,039.00 | 0.01 | View Importer | View Supplier |
