31/Mar/2020 | 28332400 | 07050607 # & Chemical KG-536-1 contains Nickel (II) sulfate hexahydrate (NiSO4.6H2O) 35%, Organic acid 6%, chemicals used in nickel plating industry | Japan | liter | 40.00 | 285.30 | 7.13 | View Importer | View Supplier |
31/Mar/2020 | 28351000 | 07050608 # & Chemical KG-536-2 contains Sodium hypophosphite (NaH2PO2.H2O) 60%, Organic acid 1%, chemicals used in nickel plating | Japan | liter | 60.00 | 383.55 | 6.39 | View Importer | View Supplier |
31/Mar/2020 | 38140000 | TKV0013 # & Niken TOP NICORON EH-1LF Nickel Plating Ingredients: Metal Salt, Organic Acid, Water. | Japan | liter | 320.00 | 1,283.84 | 4.01 | View Importer | View Supplier |
31/Mar/2020 | 38249999 | 07010120 # & Chemicals KG-545Y contain Ethylene di-amine tetra-acetic acid (C10H16N2O8) 1% and Organic acid 50% are chemicals used in the nickel plating industry | Japan | liter | 40.00 | 438.29 | 10.96 | View Importer | View Supplier |
31/Mar/2020 | 39119000 | Chemicals used as raw materials for the production of liquid copper plating additives, including organic polymers 25%, denoting COMP.10996 *, 18kg / Polybtl, 100% new | Japan | kg | 18.00 | 2,400.78 | 133.38 | View Importer | View Supplier |
31/Mar/2020 | 39119000 | Chemical preparations used as raw materials for the production of liquid copper-plated additives, composed of 50% organic polymers and 50% water, symbol of COMP.11165, 20kg / CTN, 100% new | Japan | kg | 60.00 | 7,660.23 | 127.67 | View Importer | View Supplier |
31/Mar/2020 | 39119000 | Chemical preparations used as raw materials for the production of liquid copper-plated additives, composed of 50% organic polymers and 50% water, symbol of COMP.11165, 0.7Kg / Ctn, brand new 100% (Goods FOC) | Japan | kg | 0.70 | 89.37 | 127.67 | View Importer | View Supplier |
30/Mar/2020 | 38249999 | Cleaner Conditioner (TM) XP2285 is Monoethanolamine 1 - 10%, Non-ionic surfactant 1 - 5%, Triethanolamine 1 - 5%, Organic compound <1%, Diethanolamine <1% used in plating industry | Japan | liter | 960.00 | 5,282.21 | 5.50 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | Copper Gleam HVS-202A (J) copper plating surface brightening solution (water 90-99%; Formaldehyde 0.1-1%; Organic sulfur compound 0.1-1%; Sulfuric acid 0.1-1% ; Copper sulfate 0.1-1%) (1 can = 20 Liters) | Japan | liter | 960.00 | 20,160.00 | 21.00 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 07020407 # & Cleaner Conditioner (TM) XP2285 is Monoethanolamine 1-10%, Non-ionic surfactant 1-5%, Triethanolamine 1-5%, Organic compound <1%, Diethanolamine <1% used in plating industry | Japan | liter | 600.00 | 3,774.00 | 6.29 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 07020407 # & Cleaner Conditioner (TM) XP2285 is Monoethanolamine 1-10%, Non-ionic surfactant 1-5%, Triethanolamine 1-5%, Organic compound <1%, Diethanolamine <1% used in plating industry | Japan | liter | 1,000.00 | 6,290.00 | 6.29 | View Importer | View Supplier |
26/Mar/2020 | 38249999 | 07020407 # & Cleaner Conditioner (TM) XP2285 is Monoethanolamine 1-10%, Non-ionic surfactant 1-5%, Triethanolamine 1-5%, Organic compound <1%, Diethanolamine <1% used in plating industry | Japan | liter | 40.00 | 251.60 | 6.29 | View Importer | View Supplier |
25/Mar/2020 | 38101000 | Preparing to clean the metal surface used in plating, powder, 20kg / bag TOP RIP F-85, tp include organic compounds, inorganic salts, 100% new # & JP | Japan | kg | 60.00 | 676.22 | 11.27 | View Importer | View Supplier |
25/Mar/2020 | 38109000 | Polishing layer, processing products used in plating TOP TOP SELENA DDX-1, tp: organic compounds, ethanol, isopropyl alcohol, water, 20 liters / can, liquid, 100% new (cas 64-17-5,67- 63-0,7732-18-5) | Japan | liter | 40.00 | 396.50 | 9.91 | View Importer | View Supplier |
25/Mar/2020 | 38109000 | Lining additives, coating products used in plating TOP TOP SELENA DDX-2, tp: are organic compounds, ethanol, isopropyl alcohol, water, liquid 20L / can, new 100% (cas64-17-5,67- 63-0,7732-18-5) | Japan | liter | 200.00 | 1,366.93 | 6.83 | View Importer | View Supplier |