31/Mar/2020 | 38249999 | Brightener Leveller TL - a mixture of organic substances Organic diol-CAS: 110-63-4; Glycol -CAS: 107-21-1; Aromatic carboxylic acid-CAS: 50-21-5 for leveling the surface of layers Ni plating used in industry | Singapore | liter | 725.00 | 3,465.50 | 4.78 | View Importer | View Supplier |
31/Mar/2020 | 38249999 | 07010120 # & Chemicals KG-545Y contain Ethylene di-amine tetra-acetic acid (C10H16N2O8) 1% and Organic acid 50% are chemicals used in the nickel plating industry | Japan | liter | 40.00 | 438.29 | 10.96 | View Importer | View Supplier |
30/Mar/2020 | 38249999 | Preparations used in plating to polish the surface of electroplated copper CUPROSTAR ST-2000 CORRECTOR (ingredients: sulfuric acid 1-10%, Organic salt 0.1-1%, copper su (according to ptpl No. 119 / TB-KĐHQ day) 10/05/2019) | Taiwan | liter | 200.00 | 5,200.00 | 26.00 | View Importer | View Supplier |
30/Mar/2020 | 38249999 | Cleaner Conditioner (TM) XP2285 is Monoethanolamine 1 - 10%, Non-ionic surfactant 1 - 5%, Triethanolamine 1 - 5%, Organic compound <1%, Diethanolamine <1% used in plating industry | Japan | liter | 960.00 | 5,282.21 | 5.50 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | Copper Gleam HVS-202A (J) copper plating surface brightening solution (water 90-99%; Formaldehyde 0.1-1%; Organic sulfur compound 0.1-1%; Sulfuric acid 0.1-1% ; Copper sulfate 0.1-1%) (1 can = 20 Liters) | Japan | liter | 960.00 | 20,160.00 | 21.00 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 07020407 # & Cleaner Conditioner (TM) XP2285 is Monoethanolamine 1-10%, Non-ionic surfactant 1-5%, Triethanolamine 1-5%, Organic compound <1%, Diethanolamine <1% used in plating industry | Japan | liter | 600.00 | 3,774.00 | 6.29 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 07020407 # & Cleaner Conditioner (TM) XP2285 is Monoethanolamine 1-10%, Non-ionic surfactant 1-5%, Triethanolamine 1-5%, Organic compound <1%, Diethanolamine <1% used in plating industry | Japan | liter | 1,000.00 | 6,290.00 | 6.29 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | DE88A STARTER 6X - 55G Preparations for plating industry The main components are sodium, benzoate and ammonium organic compound, 208 liters / drum, CAS: 7732-18-5; 532-32-1. 100% new goods | Singapore | liter | 1,456.00 | 9,158.24 | 6.29 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | BRT II CONC A - 55G (208LIT): Preparations for plating industry are mainly sodium, benzoate and organic ammonium compounds, 208 Lit / drum, CAS code: 7732-18-5, 100% new. | United States of America | liter | 1,248.00 | 2,995.20 | 2.40 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | BRT II CONC A - 55G (208LIT): Preparations for plating industry are mainly sodium, benzoate and organic ammonium compounds, 208 Lit / drum, CAS code: 7732-18-5, 100% new. | United States of America | liter | 624.00 | 1,497.60 | 2.40 | View Importer | View Supplier |
26/Mar/2020 | 38249999 | 07020407 # & Cleaner Conditioner (TM) XP2285 is Monoethanolamine 1-10%, Non-ionic surfactant 1-5%, Triethanolamine 1-5%, Organic compound <1%, Diethanolamine <1% used in plating industry | Japan | liter | 40.00 | 251.60 | 6.29 | View Importer | View Supplier |
25/Mar/2020 | 38249999 | Preparations used in plating: Top Lucina HV-WA coating additives, tp: organic pigments, ethylene glycol and organic acids, 20 liter / can liquid, 100% new (cas 7758-99-8 , 7732-18-5) Kqptpl: 7299 / TB-TCHQ | Japan | liter | 100.00 | 5,707.60 | 57.08 | View Importer | View Supplier |
25/Mar/2020 | 38249999 | 07020407 # & Cleaner Conditioner (TM) XP2285 is Monoethanolamine 1-10%, Non-ionic surfactant 1-5%, Triethanolamine 1-5%, Organic compound <1%, Diethanolamine <1% used in plating industry | Japan | liter | 600.00 | 3,774.00 | 6.29 | View Importer | View Supplier |
24/Mar/2020 | 38249999 | Copper Gleam HVS-202A (J) copper plating surface brightening solution (water 90-99%; Formaldehyde 0.1-1%; Organic sulfur compound 0.1-1%; Sulfuric acid 0.1-1% ; Copper sulfate 0.1-1%) | Japan | liter | 640.00 | 11,955.65 | 18.68 | View Importer | View Supplier |
23/Mar/2020 | 38249999 | Chemical preparations for plating industry containing copper sulphate, organic h / c, additives, DS-COPPER M liquid, t / p: Sulfuric acid 2.3%, and 95.1% water. 100% new (According to the KQPTPL125 / TB-KĐHQ, February 8, 18), NSX: KPMTECH (20L / can) | Korea (Republic) | liter | 640.00 | 4,070.40 | 6.36 | View Importer | View Supplier |