| 30/Mar/2020 | 38249999 | Preparations used in plating to polish the surface of electroplated copper CUPROSTAR ST-2000 CORRECTOR (ingredients: sulfuric acid 1-10%, Organic salt 0.1-1%, copper su (according to ptpl No. 119 / TB-KĐHQ day) 10/05/2019) | Taiwan | liter | 200.00 | 5,200.00 | 26.00 | View Importer | View Supplier |
| 26/Mar/2020 | 38249999 | NPL136 # & Mixture of substances used in plating - COPPER GLEAM (TM) HS-200 PART A (Sulfuric Acid <1%, Copper sulfate (CuSO4) 0.1% <1%, Organic salt 1% -10%, Water> 90 %) | Taiwan | ml | 100,000.00 | 1,619.00 | 0.02 | View Importer | View Supplier |
| 19/Mar/2020 | 38249999 | Antioxidant used in plating, Main ingredient is organic salt, acetic acid in water-Water Anti Oxidant Flux CL-5080, brand new 100%. According to KQPTPL No. 468 / PTPLMN-NV, (NPLSX board go | Taiwan | kg | 640.00 | 3,680.00 | 5.75 | View Importer | View Supplier |
| 13/Mar/2020 | 38249999 | METAL SURFACE ADDITIVE FSM-07 - Additive for surface treatment of metals. Mixture of inorganic and organic substances used in plating. (968 / PTPLHCM-NV, July 22, 2010) | Taiwan | kg | 36.00 | 631.80 | 17.55 | View Importer | View Supplier |
| 24/Jan/2019 | 38249999 | METAL SURFACE ADDITIVE FSM-07 - FSM-07 metal surface treatment admixture. A mixture of inorganic and organic substances used in plating. (968 / PTPLHCM-NV July 22, 2010) | Taiwan | Lit | 36.00 | 0.03 | 0.00 | View Importer | View Supplier |
| 14/Jan/2019 | 38249999 | NPLSX electronic board: Water Anti Oxidant Flux CL-5080 - Antioxidant used in plating , Main component is organic salt , acetic acid in water environment | Taiwan | Kg | 640.00 | 3,417.60 | 5.34 | View Importer | View Supplier |
