| 23/Mar/2020 | 38249999 | Chemical preparations for plating industry containing copper sulphate, organic h / c, additives, DS-COPPER M liquid, t / p: Sulfuric acid 2.3%, and 95.1% water. 100% new (According to the KQPTPL125 / TB-KĐHQ, February 8, 18), NSX: KPMTECH (20L / can) | Korea (Republic) | liter | 640.00 | 4,070.40 | 6.36 | View Importer | View Supplier |
| 18/Mar/2020 | 38249999 | Additives used for gold plating (chemical composition: Potassium Citrate, Anhydrous, Phosphate Compound, Water, Organic Acid) -KG-120 Balancer (according to PTPL results: 1026 / TB-TCHQ dated June 12, 2019) - 100% new | Korea (Republic) | liter | 30.00 | 1,389.18 | 46.31 | View Importer | View Supplier |
| 14/Mar/2020 | 38249999 | KG-545Y plating solution, for gold plating industry, t / p: Organic Acid 40 ~ 50%, and water 50 ~ 60%. New 100%. (20L / can), NSX: KENSCO, Korea. | Korea (Republic) | liter | 500.00 | 5,550.00 | 11.10 | View Importer | View Supplier |
| 13/Mar/2020 | 38249999 | KG-545Y plating solution, for gold plating industry, t / p: Organic Acid 40 ~ 50%, and water 50 ~ 60%. New 100%. (20L / can) | Korea (Republic) | liter | 500.00 | 5,550.00 | 11.10 | View Importer | View Supplier |
| 17/Jan/2019 | 38140000 | Organic solvent mixture used for plating of BELT STRIP (BS) -180 (Nitric Acid-HNO3-23% , Methane sulfonic acid-CH4O-15% , Ferric nitrate-2.4% , Distilled wat- 59.6%) 100% brand new | Korea (Republic) | Lit | 1,000.00 | 1,600.00 | 1.60 | View Importer | View Supplier |
| 17/Jan/2019 | 38140000 | The mixture of organic solvents used in plating T-HSM mobile phone components , (CAS: 75-75-2 (4.9%) 7732-18-5 (95.1%) , 100% new | Korea (Republic) | Kg | 200.00 | 3,000.00 | 15.00 | View Importer | View Supplier |
| 17/Jan/2019 | 38140000 | The mixture of organic solvents used in plating MS-TIN mobile phone components , (CAS: 53408-94-9 (51%) , 75-75-2 (8%) , 7732-18-5 (41 %), new 100% | Korea (Republic) | Lit | 200.00 | 2,800.00 | 14.00 | View Importer | View Supplier |
| 17/Jan/2019 | 38140000 | The mixture of organic solvents used in plating mobile phone components MS-ACID , (CAS: 75-75-2 (4.9%) , 7732-18-5 (95.1%) , 100% new | Korea (Republic) | Kg | 270.00 | 1,080.00 | 4.00 | View Importer | View Supplier |
| 15/Jan/2019 | 38249999 | 41 # & Preparations chemicals used in plating industry liquid. The main components include potassium citrate salt, phosphate salt mixture, organic compound containing amino functional groups in water environment | Korea (Republic) | Kg | 258.48 | 2,049.75 | 7.93 | View Importer | View Supplier |
| 10/Jan/2019 | 38140000 | The mixture of organic solvents used for plating Descale salt mobile phone components (the chemical composition is META SODIUM PERSULFATE-60-80% , Surfactant-20-40% , Stabilizer 1-10%). 100% new | Korea (Republic) | Kg | 48.00 | 279.36 | 5.82 | View Importer | View Supplier |
| 03/Jan/2019 | 38249999 | Chemical preparations for plating industry, consisting of 0.7% Sulfuric acid, Organic sulfur compound 0.2% , symbol CU-BRITE 30B , 20L / polybtl , 100% new | Korea (Republic) | Lit | 600.00 | 5,731.20 | 9.55 | View Importer | View Supplier |
