| 31/Mar/2020 | 28332400 | 07050607 # & Chemical KG-536-1 contains Nickel (II) sulfate hexahydrate (NiSO4.6H2O) 35%, Organic acid 6%, chemicals used in nickel plating industry | Japan | liter | 40.00 | 285.30 | 7.13 | View Importer | View Supplier |
| 31/Mar/2020 | 28351000 | 07050608 # & Chemical KG-536-2 contains Sodium hypophosphite (NaH2PO2.H2O) 60%, Organic acid 1%, chemicals used in nickel plating | Japan | liter | 60.00 | 383.55 | 6.39 | View Importer | View Supplier |
| 31/Mar/2020 | 38249999 | 07010120 # & Chemicals KG-545Y contain Ethylene di-amine tetra-acetic acid (C10H16N2O8) 1% and Organic acid 50% are chemicals used in the nickel plating industry | Japan | liter | 40.00 | 438.29 | 10.96 | View Importer | View Supplier |
| 06/Mar/2020 | 29161490 | 0 # & Chemicals s / d to resist oxidized copper after Etching or printed circuit board copper plating (Triethanol amine 3%, 2-Methyl-2,4-pentanediol 25%, compound 67%, Organic nitrogen 25%) (TOP RINSE CU-5) (SB030100051) | Japan | liter | 504.00 | 13,083.29 | 25.96 | View Importer | View Supplier |
| 06/Mar/2020 | 29161490 | 0 # & Chemicals s / d to resist oxidized copper after Etching or printed circuit board copper plating (Triethanol amine 3%, 2-Methyl-2,4-pentanediol 25%, compound 67%, Organic nitrogen 25%) (TOP RINSE CU-5) (SB030100051) | Japan | liter | 126.00 | 3,245.79 | 25.76 | View Importer | View Supplier |
| 06/Mar/2020 | 29161490 | 0 # & Chemicals s / d to resist oxidized copper after Etching or printed circuit board copper plating (Triethanol amine 3%, 2-Methyl-2,4-pentanediol 25%, compound 67%, Organic nitrogen 25%) (TOP RINSE CU-5) (SB030100051) | Japan | liter | 414.00 | 10,664.72 | 25.76 | View Importer | View Supplier |
| 04/Mar/2020 | 38249999 | 07010120 # & Chemicals KG-545Y contain Ethylene di-amine tetra-acetic acid (C10H16N2O8) 1% and Organic acid 50% are chemicals used in the nickel plating industry | Japan | liter | 40.00 | 567.73 | 14.19 | View Importer | View Supplier |
