Date | HS Code | Product Description | Origin Country | Unit | Quantity | Total Value [USD] | Unit Price [USD] | Importer Name | Supplier Name |
---|---|---|---|---|---|---|---|---|---|
10/Mar/2020 | 84804100 | Metal injection mold, high pressure injection form, creating metal frame to support the circuit board, PCB of mobile phone (MOLD_Cover, Middle_MCK71364499 * 16 * 575884). 100% new | Korea (Republic) | piece/pcs | 1.00 | 13,236.00 | 13,236.00 | View Importer | View Supplier |