| 12/Mar/2020 | 28332400 | U0006 chemical solution has a stable effect of chemical concentration in the plating process of components containing Nickel (II) sulfate hexahydrate (<15%), 100% new. | Japan | liter | 30.00 | 2,421.90 | 80.73 | View Importer | View Supplier |
| 09/Mar/2020 | 28439000 | Precious metal compound Paladium Nitrate, (Palladium Solution) ingredient (Nitric Acid 20%, Palladium Nitrate 15%, water 65%), used in metal surface plating process, brand new 100% | Japan | kg | 176.80 | 1,614,864.68 | 9,133.85 | View Importer | View Supplier |
| 31/Jan/2019 | 28332400 | Additive in copper plating circuit board U0006 contains Nickel (II) sulfate hexahydrate (<15%) , 100% new | Japan | Lit | 10.00 | 807.30 | 80.73 | View Importer | View Supplier |
| 21/Jan/2019 | 28439000 | Precious metal compound Paladi Nitrate , (Palladium Solution) ingredient (Nitric Acid 20% , Palladium Nitrate 15% , 65% water) , used in metal surface plating process , 100% new | Japan | Kg | 163.80 | 954,827.87 | 5,829.23 | View Importer | View Supplier |
| 17/Jan/2019 | 28332400 | Additive in copper plating circuit board U0006 contains Nickel (II) sulfate hexahydrate (<15%) , 100% new | Japan | Lit | 10.00 | 807.30 | 80.73 | View Importer | View Supplier |
