| 21/Mar/2020 | 35061000 | ECCOBOND 504001-MOD 10cc vial electronic component glue (including: Epoxy Resin 35-42%, Filler 34-42%, Epichlorohyd.-bisphenol A resin MW 3-9%, ...). 100% new | China | bottle / jar / tube | 3.00 | 57.80 | 19.27 | View Importer | View Supplier |
| 11/Jan/2019 | 35061000 | STYCAST 50400-1 MOD BULK electronic component mounting glue (Including: Polyepoxides 30-40% , Filler 30-40% , Epoxy Resin 1-10% , 2 , 3-Epoxypropyl neodecanoate1-10%) | Korea (Republic) | Bottle/Jar/Tube | 2.00 | 148.24 | 74.12 | View Importer | View Supplier |
| 04/Jan/2019 | 35061000 | STYCAST 50400-1 MOD BULK electronic component mounting glue (Including: Polyepoxides 30-40% , Filler 30-40% , Epoxy Resin 1-10% , 2 , 3-Epoxypropyl neodecanoate1-10%) | Korea (Republic) | Bottle/Jar/Tube | 15.00 | 1,111.81 | 74.12 | View Importer | View Supplier |
