| 31/Mar/2020 | 85340010 | HK07 # & Circuit board to make mobile phone main page key. Single-sided circuit board, raw materials used to produce the main page. Steel + plastic material. Manufacturer: DAEDUCK, 100% brand new. | Vietnam | piece/pcs | 42,369.00 | 12,973.39 | 0.31 | View Importer | View Supplier |
| 31/Mar/2020 | 85340090 | Printed flexible circuit (not assembled), used for mobile phones. 100% new product, code: N08F01003 | China | piece/pcs | 8,500.00 | 582.70 | 0.07 | View Importer | View Supplier |
| 31/Mar/2020 | 85340090 | Printed flexible circuit (not assembled), used for mobile phones. 100% new product, code: N08F01004 | China | piece/pcs | 8,500.00 | 1,713.14 | 0.20 | View Importer | View Supplier |
| 31/Mar/2020 | 85340090 | Printed flexible circuit (not assembled), used for mobile phones. 100% new product, code: N08F01005 | China | piece/pcs | 8,500.00 | 2,796.96 | 0.33 | View Importer | View Supplier |
| 31/Mar/2020 | 85340090 | Printed flexible circuit (not assembled), used for mobile phones. 100% new product, code: N08F01006 | China | piece/pcs | 8,500.00 | 5,117.16 | 0.60 | View Importer | View Supplier |
| 31/Mar/2020 | 85340010 | HK07 # & One-sided raw printed circuit board in main page of mobile phone. NVL goods used to produce main page key, manufacturer: AKM, 100% new | China | piece/pcs | 29,459.00 | 7,529.72 | 0.26 | View Importer | View Supplier |
| 31/Mar/2020 | 85340030 | UNXPEDP0091 # & Multi-layer soft printed circuit without components used in manufacturing mobile phones, model (R0.6) SM-G888N0 POGO PBA | Korea (Republic) | piece/pcs | 2,000.00 | 424.80 | 0.21 | View Importer | View Supplier |
| 31/Mar/2020 | 85340030 | EXAPEDP0143 # & Multi-layer printed circuit board without components used in manufacturing mobile phones, model SM-T595 POGO PBA | Korea (Republic) | piece/pcs | 23,940.00 | 2,927.86 | 0.12 | View Importer | View Supplier |
| 31/Mar/2020 | 85340030 | UNXPEDF0027 # & Multi-layer flexible printed circuit board without components used in manufacturing mobile phones, model (R0.3) SM-R825 MIC PBA | Korea (Republic) | piece/pcs | 20,000.00 | 954.00 | 0.05 | View Importer | View Supplier |
| 31/Mar/2020 | 85340030 | UNXPEDF0028 # & Multi-layer flexible printed circuit board without components used in manufacturing mobile phones, model (R0.5) SM-R835 MIC PBA | Korea (Republic) | piece/pcs | 20,000.00 | 984.00 | 0.05 | View Importer | View Supplier |
| 31/Mar/2020 | 85340090 | Circuit board used to manufacture mobile phone components SM-G988B CTC (CO) _FPCB. 100% new | Korea (Republic) | piece/pcs | 22,704.00 | 10,246.32 | 0.45 | View Importer | View Supplier |
| 30/Mar/2020 | 85340020 | CFP1507HQ # & Double-sided printed circuit board model: CFP-1507-H-043, parameters: FR4,2 layer, 0.8t, manufacturer: Check on used to assemble manufacturing mobile phone board. New 100% | HongKong | piece/pcs | 67,950.00 | 815.40 | 0.01 | View Importer | View Supplier |
| 30/Mar/2020 | 85340020 | CFP1661HQ # & Duplex printed circuit board model: PCB CFP-1661-H-000, manufacturer: check on used to assemble the production of mobile phone headset boards. New 100%. | HongKong | piece/pcs | 35,200.00 | 418.88 | 0.01 | View Importer | View Supplier |
| 30/Mar/2020 | 85340020 | EHS61N (EP) # & EHS-61-Ver1.2 printed circuit board (Don't use bead) parameters: FR-4.0.6t, manufacturer: check on used to assemble manufacturing mobile phone headsets. New 100% | HongKong | piece/pcs | 81,900.00 | 794.43 | 0.01 | View Importer | View Supplier |
| 30/Mar/2020 | 85340020 | EHS64 (EP) # & Duplex printed circuit board model: EHS-64 Ver1.4.2, parameters: FR-4, manufacturer: Check on used to assemble manufacturing mobile phone board. New 100% | HongKong | piece/pcs | 180,837.00 | 2,206.21 | 0.01 | View Importer | View Supplier |
