| 16/Mar/2020 | 38101000 | Tin solder paste, paste paste formulations (containing tin metal powder, Ag, Cu, turpentine and additives) EFC-3C05-30-MH, ECOJOIN manufacturer, 100% new | Korea (Republic) | kg | 300.00 | 15,180.00 | 50.60 | View Importer | View Supplier |
| 16/Mar/2020 | 38101000 | Solder paste, paste formulations (containing tin metal powder Sn, Ag, Cu, turpentine and additives), EFC-3A10-30-MH, manufacturer ECOJOIN, 100% new. | Korea (Republic) | kg | 150.00 | 6,270.00 | 41.80 | View Importer | View Supplier |
| 31/Jan/2019 | 38140000 | AC000-006AA # & Enhance the adhesion of MH 301 HARDENER ink. (Contains: Diethylene triamine 65% , Bisphenol Epoxy 20% , 2-Butoxyethanol 10% , 1 , 5 , 5-trimethylcyclohexene-3-one 5%) | Korea (Republic) | Kg | 1.00 | 239.91 | 239.91 | View Importer | View Supplier |
