14/Mar/2020 | 38249999 | Surface activating solution item code KG-529, used for printed circuit board plating industry, t / p: Hydrochloric acid 2 ~ 7%, Ammonium chloride 6 ~ 12%, and water 82 ~ 91%. New 100%. (20L / can), NSX: KENSCO, Korea. | Korea (Republic) | liter | 440.00 | 18,216.00 | 41.40 | View Importer | View Supplier |
14/Mar/2020 | 38249999 | KEN-531H non-electrolytic nickel plating solution for printed circuit board plating industry, t / p: 5% Sodium hydroxide, 5% Aliphatics amines, and 90% water. New 100%. (20L / can), NSX: KENSCO, Korea. | Korea (Republic) | liter | 120.00 | 733.20 | 6.11 | View Importer | View Supplier |
14/Mar/2020 | 38249999 | KEN-531B non-electrolytic nickel plating solution, used for printed circuit board industry, t / p: 60% Sodium hypophosphite, and 40% water. 100% new goods (20L / can), NSX: KENSCO, Korea. | Korea (Republic) | liter | 520.00 | 2,844.40 | 5.47 | View Importer | View Supplier |
14/Mar/2020 | 38249999 | KEN-531C electrolytic nickel plating solution, for printed circuit board plating industry, t / p: 13% Sodium hydroxide, 2% Aliphatic amines, and 85% water. New 100%. (20L / can), NSX: KENSCO, Korea. | Korea (Republic) | liter | 520.00 | 1,523.60 | 2.93 | View Importer | View Supplier |
14/Mar/2020 | 38249999 | KG-545Y plating solution, for gold plating industry, t / p: Organic Acid 40 ~ 50%, and water 50 ~ 60%. New 100%. (20L / can), NSX: KENSCO, Korea. | Korea (Republic) | liter | 500.00 | 5,550.00 | 11.10 | View Importer | View Supplier |
14/Mar/2020 | 38249999 | KEN-531H non-electrolytic nickel plating solution for printed circuit board plating industry, t / p: 5% Sodium hydroxide, 5% Aliphatics amines, and 90% water. New 100%. (20L / can), NSX: KENSCO, Korea. | Korea (Republic) | liter | 100.00 | 611.00 | 6.11 | View Importer | View Supplier |