| 27/Mar/2020 | 35069100 | RAA34549103 # & Adhesive from epoxy resin, used for manufacturing the circuit of mobile phones (Bisphenol F 75 - 85%, Amine Adduct 10 - 20%, Imidazole 1 - 5%, Pigment 0.1 - 1.0%, Secret 3 - 10%) ( RAA34549103). 100% new | Korea (Republic) | ml | 250.00 | 47.47 | 0.19 | View Importer | View Supplier |
| 12/Mar/2020 | 35069100 | RAA34549103 # & Adhesive from epoxy resin, used for manufacturing the circuit of mobile phones (Bisphenol F 75 - 85%, Amine Adduct 10 - 20%, Imidazole 1 - 5%, Pigment 0.1 - 1.0%, Secret 3 - 10%) ( RAA34549103). 100% new | Korea (Republic) | ml | 750.00 | 142.42 | 0.19 | View Importer | View Supplier |
| 21/Jan/2019 | 38101000 | VT194 # & Glicoat SMD # 400 plating chemicals (CH3COOH 9.9% , Imidazole derivative <1% , Water> 89.1%). (GP 12846 minus 20 liters , GP 14435 minus 20 liters) | Japan | Ml | 40,000.00 | 2,024.57 | 0.05 | View Importer | View Supplier |
