| 27/Mar/2020 | 38249999 | 07020131 # & MICROFILL THF LEVELER SOLUTION (TM) containing 90-99% Water, Sulfuric Acid <1.0%, Copper sulfate <1.0%, Imidazole polymer <1.0% used in electroplating technology | Taiwan | liter | 100.00 | 7,319.00 | 73.19 | View Importer | View Supplier |
| 23/Mar/2020 | 38249999 | 07020131 # & MICROFILL THF LEVELER SOLUTION (TM) containing 90-99% Water, Sulfuric Acid <1.0%, Copper sulfate <1.0%, Imidazole polymer <1.0% used in electroplating technology | Taiwan | liter | 100.00 | 7,319.00 | 73.19 | View Importer | View Supplier |
| 03/Mar/2020 | 38249999 | CM-00092 # & Glicoat-SMD # 100 Coating for smoothing the surface of circuit boards (CH3COOH 5%, NH3 <1%, Substituted imidazole derivative <1%, Organic acid <1%, water> 92%) | Japan | liter | 300.00 | 2,520.00 | 8.40 | View Importer | View Supplier |
| 03/Mar/2020 | 38249999 | CM-00092 # & Glicoat-SMD # 100 Coating for smoothing the surface of circuit boards (CH3COOH 5%, NH3 <1%, Substituted imidazole derivative <1%, Organic acid <1%, water> 92%) | Japan | liter | 100.00 | 840.00 | 8.40 | View Importer | View Supplier |
| 03/Mar/2020 | 38249999 | CM-00093 # & Chemicals for glazing and anti-oxidation of GLICOAT-SMD F2 (LX) board (CH3COOH: 9.9%, NH3 <1%, Substituted imidazole derivative <1%, copper complexing agent <1%, Additive <1%, water> 86.1%) | Japan | liter | 200.00 | 3,560.00 | 17.80 | View Importer | View Supplier |
