| 31/Jan/2019 | 38249999 | 3 # & CM-00111: Solvent ICP Nicoron FPF-2SV (C3H9NO3: 12% , NaH2PO2.H2O 40% , 48% Water) for nickel plating line | Japan | Lit | 400.00 | 3,716.65 | 9.29 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | 3 # & CM-00115: Solvent ICP Nicoron FPF-MS (C4H12N2O5 37%; NaH2PO2.H2O: 12% , 51% water) for nickel plating line | Japan | Lit | 480.00 | 4,028.51 | 8.39 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | MM04-004896 # & Chemical Additives Copper Plating , Used in plating process | Korea (Republic) | Lit | 800.00 | 2,632.00 | 3.29 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | MM04-004897 # & Additive copper plated , provide CU2 + for the board | Korea (Republic) | Lit | 800.00 | 1,096.00 | 1.37 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | MM04-005941 # & COOKING SOLUTION GMZ20A | Korea (Republic) | Lit | 160.00 | 2,120.00 | 13.25 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | MM04-005531 # & MIKO AUROMERSE GOLD PLATED SERVICES | Korea (Republic) | Lit | 40.00 | 873.20 | 21.83 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | MM04-005942 # & COOKING SOLUTION GMZ20B | Korea (Republic) | Lit | 160.00 | 1,972.80 | 12.33 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | MM04-000045 # & EXPOSURE , CREATING ABRASIVES AND EATING SURFACE TABLES | Korea (Republic) | Lit | 160.00 | 227.20 | 1.42 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Chemical products containing a mixture of liquid salts (FREE-NI BLACK # B) (20L / CAN) (Ingredients: Cobalt chloride , ammonium chloride , carbonic acid ammonium salt , Sodium chloride) (new products 100%) .Number 180 / TB-KÐHQ | Korea (Republic) | Lit | 80.00 | 720.00 | 9.00 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Microfill EVF Brightener Solution contains 90-99% water, Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology (20L / T-1,515) kg) | Taiwan | Lit | 1,500.00 | 21,150.00 | 14.10 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-505kg) | Taiwan | Lit | 500.00 | 9,410.00 | 18.82 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Microfill (TM) EVF-C2 solution contains Sulfuric acid (H2SO4) 0 , 1-1% , Copper sulfate (CuSO4) 0 , 1-1% , Formaldehyde (CH2O) 0 , 1-1% , Polyalkyleneglycol used in plating industry 11095904 (20L / T) | Japan | Lit | 500.00 | 10,440.00 | 20.88 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | 3 # & CM-00148: Corrosive liquid used to remove excess coating , trimming of the product after copper plating Shadow Microetch HP N500 (H2SO4: 1-5%; NaOH: 1-5%; C2H6O2 <3 %; C7H8O3S: 5-10% , Water: 77-90%) | Taiwan | Lit | 209.00 | 1,881.00 | 9.00 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Circuposit (TM) MLB neutralizer 216-5 contains 60-70% water; Sulfuric acid 10-20%; Hydroxylammonium sulfate 1-10%; Glycolic acid 1-10% (20L / T-854kg) | Taiwan | Lit | 700.00 | 6,370.00 | 9.10 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1% , Oxyalkylene Polymer 15-25% , Sulfuric acid 0 , 1-1% and water 75-85 % used in electronics industry (20L / T) | Japan | Lit | 500.00 | 6,625.00 | 13.25 | View Importer | View Supplier |
