| 06/Mar/2020 | 29161490 | 0 # & Chemicals s / d to resist oxidized copper after Etching or printed circuit board copper plating (Triethanol amine 3%, 2-Methyl-2,4-pentanediol 25%, compound 67%, Organic nitrogen 25%) (TOP RINSE CU-5) (SB030100051) | Japan | liter | 504.00 | 13,083.29 | 25.96 | View Importer | View Supplier |
| 06/Mar/2020 | 29161490 | 0 # & Chemicals s / d to resist oxidized copper after Etching or printed circuit board copper plating (Triethanol amine 3%, 2-Methyl-2,4-pentanediol 25%, compound 67%, Organic nitrogen 25%) (TOP RINSE CU-5) (SB030100051) | Japan | liter | 126.00 | 3,245.79 | 25.76 | View Importer | View Supplier |
| 06/Mar/2020 | 29161490 | 0 # & Chemicals s / d to resist oxidized copper after Etching or printed circuit board copper plating (Triethanol amine 3%, 2-Methyl-2,4-pentanediol 25%, compound 67%, Organic nitrogen 25%) (TOP RINSE CU-5) (SB030100051) | Japan | liter | 414.00 | 10,664.72 | 25.76 | View Importer | View Supplier |
