| 10/Mar/2020 | 84804100 | Metal injection molds, high-pressure injection forms, creating metal frames to support the circuit boards, PCBs of mobile phones (MOLD_Cover, Middle_MCK71364499 * 15 * 575883). 100% new | Korea (Republic) | piece/pcs | 1.00 | 13,236.00 | 13,236.00 | View Importer | View Supplier |
| 10/Mar/2020 | 84804100 | Metal injection mold, high pressure injection form, creating metal frame to support the circuit board, PCB of mobile phone (MOLD_Cover, Middle_MCK71364499 * 16 * 575884). 100% new | Korea (Republic) | piece/pcs | 1.00 | 13,236.00 | 13,236.00 | View Importer | View Supplier |
| 05/Mar/2020 | 84804100 | Metal molds, high-pressure injection forms, creating metal frames for circuit boards, PCBs of mobile phones (MOLD Cover, Middle MCK71364499), new 100% | Korea (Republic) | set | 2.00 | 26,472.00 | 13,236.00 | View Importer | View Supplier |
| 03/Mar/2020 | 84804100 | Metal injection molds, high pressure injection form, creating metal frame to support the circuit board, PCB of mobile phone (MOLD Cover, Middle MCK71364499 * 14 * 575882), new 100% | Korea (Republic) | piece/pcs | 1.00 | 13,236.00 | 13,236.00 | View Importer | View Supplier |
