| 31/Jan/2019 | 38249999 | 3 # & CM-00111: Solvent ICP Nicoron FPF-2SV (C3H9NO3: 12% , NaH2PO2.H2O 40% , 48% Water) for nickel plating line | Japan | Lit | 400.00 | 3,716.65 | 9.29 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | 3 # & CM-00115: Solvent ICP Nicoron FPF-MS (C4H12N2O5 37%; NaH2PO2.H2O: 12% , 51% water) for nickel plating line | Japan | Lit | 480.00 | 4,028.51 | 8.39 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | JC-BRITE 211STB: Chemical preparations for plating industry whose main components are sulphate salts and additives in acidic environments , T / parts: Sulfuric Acid -H2SO4 0.7% , Organic sulfur compound 0.2% | Japan | Lit | 640.00 | 9,280.00 | 14.50 | View Importer | View Supplier |
| 23/Jan/2019 | 38249999 | 3 # & CM-00111: Solvent ICP Nicoron FPF-2SV (C3H9NO3: 12% , NaH2PO2.H2O 40% , 48% Water) for nickel plating line | Japan | Lit | 320.00 | 3,057.72 | 9.56 | View Importer | View Supplier |
| 23/Jan/2019 | 38249999 | 3 # & CM-00115: Solvent ICP Nicoron FPF-MS (C4H12N2O5 37%; NaH2PO2.H2O: 12% , 51% water) for nickel plating line | Japan | Lit | 640.00 | 5,523.82 | 8.63 | View Importer | View Supplier |
| 22/Jan/2019 | 38249999 | OSBD0889 # & Chemical preparations for plating industry whose main TP is sodium sulphate , sodium chloride and additives - # 81. Apply code according to PTPL 323 / CNPTPLHP-NV dated 11/05/2012 | Japan | Lit | 40.00 | 374.87 | 9.37 | View Importer | View Supplier |
| 22/Jan/2019 | 38249999 | OSBD0889 # & Preparations for plating industry include TP saccharin salt, sodium chloride and additives - # 83. Apply code according to PTPL 323 / CNPTPLHP-NV dated 11/05/2012 | Japan | Lit | 20.00 | 293.67 | 14.68 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | 3 # & Cuposit 1120SR Copper Replenisher for plating industry (Pyridine compound <1%; Sulfuric Acid H2SO4 <1% (Omnishield 1120SR) | Japan | Lit | 60.00 | 900.00 | 15.00 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | 3 # & Cuposit 1120SR Copper Replenisher for plating industry (Pyridine compound <1%; Sulfuric Acid H2SO4 <1% (Omnishield 1120SR) | Japan | Lit | 40.00 | 600.00 | 15.00 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | JC-BRITE 211SF: Chemical preparations for plating industry with T / P are sulphated salts and additives in acidic environment (Sulfuric acid-H2SO4 0.7% , Polyoxyalkylene ether 19.2% , Copper sulfate0.2%) | Japan | Lit | 800.00 | 15,424.00 | 19.28 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | JC-BRITE 211STB: Chemical preparations for plating industry whose main components are sulphate salts and additives in acidic environments , T / parts: Sulfuric Acid -H2SO4 0.7% , Organic sulfur compound 0.2% | Japan | Lit | 1,920.00 | 27,840.00 | 14.50 | View Importer | View Supplier |
| 17/Jan/2019 | 38249999 | 3 # & Cuposit 1120SR Copper Replenisher for plating industry (Pyridine compound <1%; Sulfuric Acid H2SO4 <1% (Omnishield 1120SR) | Japan | Lit | 40.00 | 600.00 | 15.00 | View Importer | View Supplier |
| 16/Jan/2019 | 38249999 | Chemical product SOLDERON (TM) MHS-W ADDITIVE 20L PLASTIC DRUM , used for copper wire tin plating tank. Package: 20 liters / carton. New 100% | Japan | Lit | 360.00 | 7,920.00 | 22.00 | View Importer | View Supplier |
| 10/Jan/2019 | 38249999 | 3 # & Cuposit 1120SR Copper Replenisher for plating industry (Pyridine compound <1%; Sulfuric Acid H2SO4 <1% (Omnishield 1120SR) | Japan | Lit | 80.00 | 1,200.00 | 15.00 | View Importer | View Supplier |
| 10/Jan/2019 | 38249999 | 3 # & Cuposit 1120SR Copper Replenisher for plating industry (Pyridine compound <1%; Sulfuric Acid H2SO4 <1% (Omnishield 1120SR) | Japan | Lit | 20.00 | 300.00 | 15.00 | View Importer | View Supplier |
