| 30/Mar/2020 | 35061000 | Glue used in manufacturing MCA-2380 50cc (Acrylated epoxy, 7631-86-9, Modified glycidyl ether, AcrylicResin, 2,3-Epoxypropyl methacrylate 106-91-2) .NX: YONGBEE TRADING COR.NW: 0.05KG / 1UNA New 100% | Korea (Republic) | bottle / jar / tube | 704.00 | 72,519.04 | 103.01 | View Importer | View Supplier |
| 27/Mar/2020 | 35069900 | 5CHJ00160A # & Component adhesives (NCA 2280), TP include Amorphous Silica, Acrylated epoxy, Epoxy Resin, Modified glycidyl ether, 2,3-Epoxypropyl methacrylate, Modificated Siloxane, Silane. (Ratio 1 CC = 1.3001G) | Korea (Republic) | g | 2,500.00 | 11,999.52 | 4.80 | View Importer | View Supplier |
| 20/Mar/2020 | 35069900 | 5CHJ00160A # & Component adhesives (NCA 2280), TP include Amorphous Silica, Acrylated epoxy, Epoxy Resin, Modified glycidyl ether, 2,3-Epoxypropyl methacrylate, Modificated Siloxane, Silane. (Ratio 1 CC = 1.3001G) | Korea (Republic) | g | 2,500.00 | 11,999.52 | 4.80 | View Importer | View Supplier |
| 13/Mar/2020 | 35069900 | AS90-7886-3 # & Adhesive LOCTITE ECCOBOND UF3808, ingredients: Epoxy resin: 25-30%, Oxirane: 20-30%, 2,3-Epoxypropyl methacrylate: 5-10%, used in manufacturing electronic circuit boards , 30ml / bottle, 100% brand new) | Korea (Republic) | bottle / jar / tube | 50.00 | 100.00 | 2.00 | View Importer | View Supplier |
| 22/Jan/2019 | 35061000 | LOCTITE ECCOBOND 50400-1MOD (Including: Polyepoxides 30-40% , Filler 30-40% , Epoxy Resin 1-10% , 2 , 3-Epoxypropyl neodecanoate1-10%) | Korea (Republic) | Bottle/Jar/Tube | 100.00 | 7,303.00 | 73.03 | View Importer | View Supplier |
| 22/Jan/2019 | 35061000 | Electronic component mounting glue 50400-1MOD (Including: Polyepoxides 30-40% , Filler 30-40% , Epoxy Resin 1-10% , 2 , 3-Epoxypropyl neodecanoate1-10%) | Korea (Republic) | Bottle/Jar/Tube | 150.00 | 11,118.09 | 74.12 | View Importer | View Supplier |
| 19/Jan/2019 | 35061000 | Electronic component mounting glue 50400-1MOD (Including: Polyepoxides 30-40% , Filler 30-40% , Epoxy Resin 1-10% , 2 , 3-Epoxypropyl neodecanoate1-10%) | Korea (Republic) | Bottle/Jar/Tube | 10.00 | 741.21 | 74.12 | View Importer | View Supplier |
| 16/Jan/2019 | 35061000 | Electronic component mounting glue 50400-1MOD (Including: Polyepoxides 30-40% , Filler 30-40% , Epoxy Resin 1-10% , 2 , 3-Epoxypropyl neodecanoate1-10%) | Korea (Republic) | Bottle/Jar/Tube | 50.00 | 3,706.03 | 74.12 | View Importer | View Supplier |
| 11/Jan/2019 | 35069900 | - # & glue ABP 2032S 10cc tube for mobile phone camera drive , main components include: Epoxy resin , 2 , 3-Epoxypropyl neodecanoate. New 100% | Korea (Republic) | Bottle/Jar/Tube | 2.00 | 214.00 | 107.00 | View Importer | View Supplier |
| 11/Jan/2019 | 35061000 | STYCAST 50400-1 MOD BULK electronic component mounting glue (Including: Polyepoxides 30-40% , Filler 30-40% , Epoxy Resin 1-10% , 2 , 3-Epoxypropyl neodecanoate1-10%) | Korea (Republic) | Bottle/Jar/Tube | 2.00 | 148.24 | 74.12 | View Importer | View Supplier |
| 04/Jan/2019 | 35061000 | STYCAST 50400-1 MOD BULK electronic component mounting glue (Including: Polyepoxides 30-40% , Filler 30-40% , Epoxy Resin 1-10% , 2 , 3-Epoxypropyl neodecanoate1-10%) | Korea (Republic) | Bottle/Jar/Tube | 15.00 | 1,111.81 | 74.12 | View Importer | View Supplier |
