| 25/Mar/2020 | 38101000 | Solder paste PVM-115, (containing metal powder (tin, copper, silver), rosin and solvent), used for soldering, gluing electronic components, used in electronics manufacturing. New 100%. | Korea (Republic) | kg | 50.00 | 3,250.00 | 65.00 | View Importer | View Supplier |
| 25/Mar/2020 | 38101000 | Welding cream YWM-115, (containing metal powder (tin, copper, silver), rosin and solvent), used for soldering, gluing electronic components, used in electronics manufacturing. New 100%. | Korea (Republic) | kg | 300.00 | 13,500.00 | 45.00 | View Importer | View Supplier |
| 16/Mar/2020 | 38249999 | CIRCUPOSIT P-6550A ELESS CU / 20L without water 80-90%, Copper sulfate 10-20%, Sulfuric acid <1%. Has the effect of improving the adhesion and surface quality of the product. Used in electronics manufacturing technology | Taiwan | liter | 9,000.00 | 31,753.76 | 3.53 | View Importer | View Supplier |
| 06/Mar/2020 | 38101000 | # & Soldering Cream PF305-153TO (500g / bottle), used for welding in electronics manufacturing. New 100% | China | kg | 60.00 | 3,600.00 | 60.00 | View Importer | View Supplier |
| 25/Jan/2019 | 38101000 | Solder paste used in electronics manufacturing , Code RAC35078101 , brand new 100% | Korea (Republic) | Kg | 40.00 | 3,069.06 | 76.73 | View Importer | View Supplier |
| 25/Jan/2019 | 38101000 | Solder paste used in electronics manufacturing , Code RAC30589001 , 100% new | Korea (Republic) | Kg | 240.00 | 16,628.98 | 69.29 | View Importer | View Supplier |
| 25/Jan/2019 | 38101000 | Solder paste used in electronics manufacturing , Code RAC30589001 , 100% new | Korea (Republic) | Kg | 160.00 | 11,085.98 | 69.29 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15 - 25% , which enhances the adhesion and surface quality of products , in electronics boards manufacturing | Japan | Lit | 640.00 | 5,440.00 | 8.50 | View Importer | View Supplier |
| 21/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15 - 25% , which enhances the adhesion and surface quality of products , in electronics boards manufacturing | Japan | Lit | 840.00 | 7,140.00 | 8.50 | View Importer | View Supplier |
| 17/Jan/2019 | 38101000 | Solder paste used in electronics manufacturing , Code RAC30589001 , 100% new | Korea (Republic) | Kg | 700.00 | 48,501.18 | 69.29 | View Importer | View Supplier |
| 17/Jan/2019 | 38101000 | Solder paste used in electronics manufacturing , Code RAC35078101 , brand new 100% | Korea (Republic) | Kg | 20.00 | 1,534.53 | 76.73 | View Importer | View Supplier |
| 17/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15 - 25% , which enhances the adhesion and surface quality of products , in electronics boards manufacturing | Japan | Lit | 1,280.00 | 10,880.00 | 8.50 | View Importer | View Supplier |
| 17/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15 - 25% , which enhances the adhesion and surface quality of products , in electronics boards manufacturing | Japan | Lit | 80.00 | 680.00 | 8.50 | View Importer | View Supplier |
| 17/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15 - 25% , which enhances the adhesion and surface quality of products , in electronics boards manufacturing | Japan | Lit | 1,520.00 | 12,920.00 | 8.50 | View Importer | View Supplier |
| 14/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15 - 25% , which enhances the adhesion and surface quality of products , in electronics boards manufacturing | Japan | Lit | 40.00 | 340.00 | 8.50 | View Importer | View Supplier |
