19/Mar/2020 | 38249999 | CM-00066 # & CUPOSIT N solution contains 85-95% water, NiSO4 1-10%, H2SO4: 1- 10%, which improve the adhesion and surface quality of products, in electronic circuit boards manufacturing | Japan | liter | 320.00 | 4,416.00 | 13.80 | View Importer | View Supplier |
19/Mar/2020 | 38249999 | CM-00048 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15-25%, which enhance the adhesion and surface quality of products, in electronic circuit boards manufacturing | Japan | liter | 640.00 | 5,440.00 | 8.50 | View Importer | View Supplier |
13/Mar/2020 | 38249999 | CM-00048 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15-25%, which enhance the adhesion and surface quality of products, in electronic circuit boards manufacturing | Japan | liter | 640.00 | 5,440.00 | 8.50 | View Importer | View Supplier |
12/Mar/2020 | 38249999 | CM-00048 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15-25%, which enhance the adhesion and surface quality of products, in electronic circuit boards manufacturing | Japan | liter | 280.00 | 2,380.00 | 8.50 | View Importer | View Supplier |
12/Mar/2020 | 38249999 | CM-00048 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15-25%, which enhance the adhesion and surface quality of products, in electronic circuit boards manufacturing | Japan | liter | 1,000.00 | 8,500.00 | 8.50 | View Importer | View Supplier |
05/Mar/2020 | 38249999 | CM-00048 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15-25%, which enhance the adhesion and surface quality of products, in electronic circuit boards manufacturing | Japan | liter | 1,280.00 | 10,880.00 | 8.50 | View Importer | View Supplier |