| 31/Mar/2020 | 38101000 | Solder paste LFM-48W NH (IMT) -A 11.5% for soldering electronic circuit boards, main TP: Sn CAS 7440-31-5 (85.40%), Ag CAS 7440-22-4 (2.66%), Older CAS 7440-50-8 (0.44%). new 100%. | Japan | kg | 10.00 | 753.11 | 75.31 | View Importer | View Supplier |
| 23/Mar/2020 | 38101000 | Solder paste, brand M705-GRN360-K2-VM, ingredients: Sn, Ag, Cu., Used to connect components with electronic boards. | Japan | kg | 25.00 | 2,384.75 | 95.39 | View Importer | View Supplier |
| 04/Mar/2020 | 38101000 | Solder paste, brand M705-GRN360-K2-VM, ingredients: Sn, Ag, Cu., Used to connect components with electronic boards. | Japan | kg | 20.00 | 1,921.39 | 96.07 | View Importer | View Supplier |
| 25/Jan/2019 | 38101000 | NBS III - 210W3C: Preparations for cleaning metal surfaces NBS III -210W3C , used in the manufacture of electronic boards (Aromatic sulfonate 3.8% , Azole derivative 4.6% , Sulfuric acid H2SO4 7.1%) | Japan | Kg | 800.00 | 13,928.00 | 17.41 | View Importer | View Supplier |
