| 31/Mar/2020 | 38101000 | SET-310 # & Solder paste, brand M705-GRN360-K2-V, component Sn - Ag - Cu (0.5 Kg / vial), used to connect components with electronic boards & X07-001038 & New products 100% | Korea (Republic) | kg | 20.00 | 1,500.00 | 75.00 | View Importer | View Supplier |
| 31/Mar/2020 | 38101000 | JMIH06 # & Cream solder (Solder paste, brand M705-GRN360-K2-V, component Sn - Ag - Cu (0.5 Kg / vial), used to connect components with electronic circuit boards) (3SL0000003- 01) 100% new goods | Korea (Republic) | kg | 50.00 | 3,650.00 | 73.00 | View Importer | View Supplier |
| 18/Mar/2020 | 38101000 | Solder paste, brand M705-SHF, ingredient Sn - Ag - Cu (0.5 Kg / vial), used to connect components with electronic boards, 100% new goods | Korea (Republic) | kg | 400.00 | 24,000.00 | 60.00 | View Importer | View Supplier |
| 18/Mar/2020 | 38101000 | Solder paste, brand M705-GRN360-K2-V, component Sn - Ag - Cu (0.5 Kg / vial), used to connect components with electronic boards, 100% new goods | Korea (Republic) | kg | 160.00 | 9,600.00 | 60.00 | View Importer | View Supplier |
| 11/Mar/2020 | 38109000 | JS-7000S-1 # & Flux circuit board cleaners: JS-7000S-1 (ingredients: Polymerized Rosin: 25-30%, Isopropyl alcohol: 65-75%, used to clean the circuit boards in manufacturing electronic circuit boards ), new 100% | Korea (Republic) | kg | 42.00 | 255.27 | 6.08 | View Importer | View Supplier |
| 11/Mar/2020 | 38140000 | S-1000 # & Solvent used with circuit cleaners S-1000 (Ingredients: Isopropyl alcohol: 98%, used in the manufacture of electronic boards), 100% new goods | Korea (Republic) | kg | 42.00 | 127.64 | 3.04 | View Importer | View Supplier |
| 10/Mar/2020 | 38101000 | Solder paste, brand M705-SHF, ingredient Sn - Ag - Cu (0.5 Kg / vial), used to connect components with electronic boards, 100% new goods | Korea (Republic) | kg | 800.00 | 48,000.00 | 60.00 | View Importer | View Supplier |
| 10/Mar/2020 | 38101000 | Solder paste, brand M705-GRN360-K2-V, component Sn - Ag - Cu (0.5 Kg / vial), used to connect components with electronic boards, 100% new goods | Korea (Republic) | kg | 400.00 | 24,000.00 | 60.00 | View Importer | View Supplier |
| 09/Mar/2020 | 38101000 | # & Solder paste, brand M705-GRN360-K2-V, component Sn - Ag - Cu (0.5 Kg / vial), used to connect components with electronic circuit boards, 100% new goods | Korea (Republic) | kg | 20.00 | 1,434.77 | 71.74 | View Importer | View Supplier |
| 09/Mar/2020 | 38101000 | M705-SHF # & Tin solder paste, M705-SHF brand, ingredients 96.5 Sn - 3.0 Ag - 0.5 Cu (0.5 Kg / vial), used to connect components with electronic boards, 100% new goods | Korea (Republic) | kg | 120.00 | 8,760.00 | 73.00 | View Importer | View Supplier |
| 30/Jan/2019 | 38101000 | Solder paste , brand M705-SHF , component 96.5 Sn - 3.0 Ag - 0.5 Cu (0.5 Kg / vial) , used to connect components with electronic circuit boards , 100% new goods | Korea (Republic) | Kg | 50.00 | 3,606.13 | 72.12 | View Importer | View Supplier |
| 24/Jan/2019 | 38101000 | Solder paste , brand M705-SHF , component 96.5 Sn - 3.0 Ag - 0.5 Cu (0.5 Kg / vial) , used to connect components with electronic circuit boards , 100% new goods | Korea (Republic) | Kg | 520.00 | 31,200.00 | 60.00 | View Importer | View Supplier |
| 24/Jan/2019 | 38101000 | Solder paste , brand M705-GRN360-K2-V , component 96.5 Sn - 3.0 Ag - 0.5 Cu (0.5 Kg / vial) , used to connect components with electronic circuit boards , New 100 % | Korea (Republic) | Kg | 40.00 | 2,400.00 | 60.00 | View Importer | View Supplier |
| 24/Jan/2019 | 38101000 | Solder paste TLF-204-HF33 , composition 96.5 Sn , 3.0 Ag , 0.5 Cu (0.5kg / vial) , used to connect components with electronic circuit boards. New 100% | Korea (Republic) | Kg | 10.00 | 1,110.69 | 111.07 | View Importer | View Supplier |
| 23/Jan/2019 | 38101000 | Solder paste , brand M705-SHF , component 96.5 Sn - 3.0 Ag - 0.5 Cu (0.5 Kg / vial) , used to connect components with electronic circuit boards , 100% new goods | Korea (Republic) | Kg | 900.00 | 54,000.00 | 60.00 | View Importer | View Supplier |
