| 30/Mar/2020 | 38249999 | CIRCUPOSIT 6530 CAT (VN) / 20L without water> 98%, Inorganic salt <1%. Has the effect of promoting the formation of copper layer inside the hole of the board. Used in electronic circuit manufacturing technology | Japan | liter | 1,280.00 | 52,313.67 | 40.87 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology. | Japan | liter | 1,280.00 | 9,157.80 | 7.15 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | CIRCUPOSIT P-6550C (VN) / 20L without water 70 -80% and Organic salt 20 - 30%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology. | Japan | liter | 640.00 | 4,622.06 | 7.22 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | CIRCUPOSIT P-6550M (VN) / 20L without water 75 - 85% and Organic salt 15 - 25%. Has the effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology. | Japan | liter | 1,280.00 | 8,759.36 | 6.84 | View Importer | View Supplier |
| 20/Mar/2020 | 38249999 | CIRCUPOSIT P-6550A ELESS CU / 20L water-resistant 80-90%, Copper sulfate 10-20%, Sulfuric acid <1%. Effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology | Taiwan | liter | 6,000.00 | 21,127.54 | 3.52 | View Importer | View Supplier |
| 16/Mar/2020 | 38249999 | CIRCUPOSIT P-6550A ELESS CU / 20L without water 80-90%, Copper sulfate 10-20%, Sulfuric acid <1%. Has the effect of improving the adhesion and surface quality of the product. Used in electronics manufacturing technology | Taiwan | liter | 9,000.00 | 31,753.76 | 3.53 | View Importer | View Supplier |
