| 27/Mar/2020 | 38249999 | Chemical products against boiler corrosion, main components include Sodium Benzotriazole, alkali compound and water, liquid-COPPER CORROSION INHIBITOR VCU-50B (compare with: 402 / TB-KĐ4 right 24/3/2017) | Taiwan | kg | 625.00 | 5,931.25 | 9.49 | View Importer | View Supplier |
| 26/Mar/2020 | 38101000 | Acid-containing metal surface cleaning products (DIA SD D) (T / P: Phosphoric Acid, Citric acid, Urea, Copper Sulfate) (KQPTPL130 / TB-KĐHQ (February 9, 2018) | Korea (Republic) | kg | 2,048.00 | 2,645.76 | 1.29 | View Importer | View Supplier |
| 25/Mar/2020 | 38249999 | CO-952098 # & Chemical products used in plating, mainly composed of copper salt and additive CUPRACID 210 MAKE-UP, CAS number: 7664-93-9; 7758-98-7. (M.952098) | China | kg | 175.00 | 1,515.64 | 8.66 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | Chemical products ELC-500A liquid for plating process (Tetrakise (2-Hydroxypropyl) ethylenediamine 10%, Copper (II) Sulfate, pentahydrate 25%) (20L / Can). | Korea (Republic) | cans / can | 240.00 | 9,098.40 | 37.91 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | Chemical products ELC-500MU liquid, used in plating process, whose main components are derivatives of ethylenediamin, copper sulphate and additives, 100% new goods (PTQ: 6439 / TB-TCHQ October 9) 2019) | Korea (Republic) | cans / can | 280.00 | 23,520.00 | 84.00 | View Importer | View Supplier |
| 23/Mar/2020 | 38101000 | Acid-containing metal surface cleaning products (DIA SD D) (T / P: Phosphoric Acid, Citric acid, Urea, Copper Sulfate) (KQPTPL130 / TB-KĐHQ (February 9, 2018) | Korea (Republic) | kg | 2,048.00 | 2,645.76 | 1.29 | View Importer | View Supplier |
| 23/Mar/2020 | 38160090 | PR-TL-000322 # & Refractory mortar - Ramming Mix (DRI-Vibe351A), used in copper melting furnace, Nsx: Allied Mineral Products, made in USA. New 100% | United States of America | kg | 3,450.00 | 5,347.50 | 1.55 | View Importer | View Supplier |
| 23/Mar/2020 | 3824999990 | 0 # & PRINTOGANTH P COPPER: Chemical products used in plating, new 100% | Malaysia | kg | 4,000.00 | 11,200.00 | 2.80 | View Importer | View Supplier |
| 20/Mar/2020 | 38249999 | Preparations of plating solution ST-300M-F with main components Sulfuric Acid <1%, Copper (II) sulfate <1%, distilled water <90%, Polyethylene Glycol <5%, new products 100% | Korea (Republic) | kg | 300.00 | 3,563.00 | 11.88 | View Importer | View Supplier |
| 20/Mar/2020 | 38249999 | COSMO K-1 COPPER PLATINAL ADDITIVES, FOR CREATING RESPONSE TO HELP GOOD GRINDING COPPER PLATED IN SPINDLE PRODUCTS. ASSESSED AT TTPTPLMN NO 1450 | Japan | liter | 760.00 | 6,384.00 | 8.40 | View Importer | View Supplier |
| 20/Mar/2020 | 38249999 | COSMO K-2 COPPER PLUG ADDITIVE, USED TO CREATE REACTIVITY TO HELP GOOD GRINDING COPPER PLATED IN SPINDLE PRODUCTS. ASSESSED AT TTPTPLMN NO 1450 | Japan | liter | 760.00 | 6,384.00 | 8.40 | View Importer | View Supplier |
| 20/Mar/2020 | 38249999 | CIRCUPOSIT P-6550A ELESS CU / 20L water-resistant 80-90%, Copper sulfate 10-20%, Sulfuric acid <1%. Effect of improving adhesion and surface quality of products. Used in electronic circuit manufacturing technology | Taiwan | liter | 6,000.00 | 21,127.54 | 3.52 | View Importer | View Supplier |
| 19/Mar/2020 | 38249999 | CM-00046 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution is used to improve adhesion and surface quality of products used in industrial equipment (Copper sulfate: 10-20%, Sulfuric acid < 1%, Water: 80-90%) | Taiwan | liter | 320.00 | 1,472.00 | 4.60 | View Importer | View Supplier |
| 19/Mar/2020 | 38249999 | CM-00048 # & CIRCUPOSIT P-6550M ELECTROLESS COPPER solution contains 75-85% water, Organic Salt: 15-25%, which enhance the adhesion and surface quality of products, in electronic circuit boards manufacturing | Japan | liter | 640.00 | 5,440.00 | 8.50 | View Importer | View Supplier |
| 18/Mar/2020 | 38249999 | SFV029 # & Copper additives (CuSO4; C3H5NaO3S, H2O) Using plating products | Taiwan | kg | 500.00 | 810.00 | 1.62 | View Importer | View Supplier |
