| 25/Jan/2019 | 35061000 | 0201-M00090 # & Glue (AE-421D) main component Epoxy resin , used to attach components to electronic boards. | Japan | G | 2,800.00 | 8,743.84 | 3.12 | View Importer | View Supplier |
| 18/Jan/2019 | 35069900 | 5REZ00031A # & component glue (SDD-100) , including HYDROFLUOROETHER (80%) , M-ENEHEXAFLUORIDE (10%) , ACRYL POLYMER (10%) , no precursors , 100% new . | Japan | G | 6,000.00 | 1,326.00 | 0.22 | View Importer | View Supplier |
| 14/Jan/2019 | 35069900 | BLV-TL-51 # & Super-X G777 component glue (Silicone modified polymer; Paraffin; Organic tin compound) | Japan | G | 4,050.00 | 617.38 | 0.15 | View Importer | View Supplier |
| 10/Jan/2019 | 35061000 | 0201-M00090 # & Glue (AE-421D) main component Epoxy resin , used to attach components to electronic boards. | Japan | G | 2,800.00 | 8,743.84 | 3.12 | View Importer | View Supplier |
| 08/Jan/2019 | 35069900 | 5REZ00031A # & component glue (SDD-100) , including HYDROFLUOROETHER (80%) , M-ENEHEXAFLUORIDE (10%) , ACRYL POLYMER (10%) , no precursors , 100% new . | Japan | G | 6,000.00 | 1,326.00 | 0.22 | View Importer | View Supplier |
