| Date | HS Code | Product Description | Origin Country | Unit | Quantity | Total Value [USD] | Unit Price [USD] | Importer Name | Supplier Name |
|---|---|---|---|---|---|---|---|---|---|
| 04/Mar/2020 | 35061000 | 23060301 # & Liquid Encapsulants CV5313HS component glue containing Epoxy Resin 75-95%, Hardener 5-20%, Silica <0.5% (10cc / tube) | Japan | piece/pcs | 100.00 | 4,093.34 | 40.93 | View Importer | View Supplier |
| 25/Jan/2019 | 35061000 | 0201-M00090 # & Glue (AE-421D) main component Epoxy resin , used to attach components to electronic boards. | Japan | G | 2,800.00 | 8,743.84 | 3.12 | View Importer | View Supplier |
| 10/Jan/2019 | 35061000 | 0201-M00090 # & Glue (AE-421D) main component Epoxy resin , used to attach components to electronic boards. | Japan | G | 2,800.00 | 8,743.84 | 3.12 | View Importer | View Supplier |
