| 13/Mar/2020 | 29151100 | Substance used for surface treatment of products after copper plating SFCOAT Cu W Plus II A (NF), Formic acid content <8%, the remaining is water, NSX: Sun Faith Chemical co., Ltd. New 100% | China | liter | 380.00 | 20,140.00 | 53.00 | View Importer | View Supplier |
| 13/Mar/2020 | 29151100 | Substances used for surface treatment after copper plating SFCOAT Cu W Plus II A, Formic acid composition <10%, the remaining is water, NSX: Sun Faith Chemical co., Ltd. New 100% | China | liter | 20.00 | 1,060.00 | 53.00 | View Importer | View Supplier |
| 13/Mar/2020 | 34029013 | Substances used for surface treatment after copper plating SFCOAT Cu W Plus II B, Acetic acid content <20%, Ammonium hydroxide <25%, the remaining is water, NSX: Sun Faith Chemical co., Ltd. New 100% | China | liter | 170.00 | 1,411.00 | 8.30 | View Importer | View Supplier |
| 09/Mar/2020 | 28070000 | Chemical solution (additive) FE-500 including sulfuric acid (1-3%) and water (balance), has the effect of corrosive printed circuit board, used for surface treatment lines of printed circuit boards, New arrivals 100 % (1 can = 20L) | Korea (Republic) | liter | 200.00 | 18,346.91 | 91.73 | View Importer | View Supplier |
