| 31/Jan/2019 | 38249999 | Cuposit (TM) 253S Electroless Copper - water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry (20L / carton) | Japan | Lit | 60.00 | 754.20 | 12.57 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | Microfill (TM) EVF-C2 solution contains Sulfuric acid (H2SO4) 0 , 1-1% , Copper sulfate (CuSO4) 0 , 1-1% , Formaldehyde (CH2O) 0 , 1-1% , Polyalkyleneglycol used in plating industry 11095904 (20 liters / carton) (1,015 Kg) | Japan | Lit | 1,280.00 | 17,716.17 | 13.84 | View Importer | View Supplier |
| 16/Jan/2019 | 38249999 | Chemical product SOLDERON (TM) MHS-W ADDITIVE 20L PLASTIC DRUM , used for copper wire tin plating tank. Package: 20 liters / carton. New 100% | Japan | Lit | 360.00 | 7,920.00 | 22.00 | View Importer | View Supplier |
| 15/Jan/2019 | 38249999 | Cuposit (TM) 253S Electroless Copper - water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry (20L / carton) | Japan | Lit | 300.00 | 3,771.00 | 12.57 | View Importer | View Supplier |
| 03/Jan/2019 | 38249999 | Cuposit (TM) 253S Electroless Copper - water mixture 80-90%; Copper sulfate 10-20%; Hydrochloric acid 0 , 1-1% used in plating industry (20L / carton) | Japan | Lit | 60.00 | 754.20 | 12.57 | View Importer | View Supplier |
